Design and Development of MEMS Pressure Sensor Characterization Setup with Low Interfacing Noise by Using NI-PXI System

  • Kulwant Singh
  • Sualeh Akhtar
  • Soney Varghese
  • J. Akhtar
Conference paper
Part of the Environmental Science and Engineering book series (ESE)


In this paper, we present a self-contained automated MEMS pressure sensor testing system. The system is controlled by LabVIEW software, with a custom-designed menu-driven user interface in the OPEN-WIN window environment. It is capable of performing multi-parameter measurements including linearity, hysteresis, sensitivity and operating temperature. The built-in software package allows the user to perform statistical analysis with image capability. This system is applicable for device research, where, the “statistical” testing data provides the reliable experimental information and device mass production, where the interfacing noise free testing data and the generated graph can help in product sorting, quality control, and further processing. Fabrication and packaging issues of MEMS pressure sensor are also discussed in terms of device performance.


MEMS Pressure sensor Device packaging LabVIEW Interfacing noise 


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The Director, CSIR-CEERI, Pilani, Dr. Chandra Shekhar is thanked for his constant support and encouragement and first author (KS) would like to thank Head of SNST, NIT Calicut, Dr. C. B. Sobhan for his consent to work in CSIR-CEERI, Pilani.


  1. 1.
    M Bowen & G Smith, “Considerations for the design of smart sensors”, Sensors an actuators, vol-A 46-47, pp 516-520 (1995).Google Scholar
  2. 2.
    J H Huijsing, “Integrated smart sensors”, Sensors and Actuator, vol-A 30, pp 167-174, (1992).CrossRefGoogle Scholar
  3. 3.
    Clark, S.K. and Wise, K.D., “Pressure sensitivity in anisotropically etched thin-diaphragm pressure sensors”, IEEE Trans. on Electron Devices, Vol. 26, pp 1887-896 (1979).CrossRefGoogle Scholar
  4. 4.
    Kendall, D.L., “A new theory for the anisotropic etching of silicon and some underdeveloped chemical micromachining concepts”, J. Vac. Sci. Technol., Vol. A8, no. 4, pp. 3598-605 (1990).CrossRefGoogle Scholar
  5. 5.
    Maseeh, F. and Senturia, S.D., “Plastic deformation of highly doped silicon”, Sensors and Actuators, Vol. A21-A23, pp. 861-5 (1990).Google Scholar
  6. 6.
    Akhtar, J., Dixit, B.B., Pant, B.D. and Deshwal, V.P., “Polysilicon piezoresistive pressure sensors based on MEMS technology”, IETE Journal of Research, Vol. 49, No. 6, pp. 365-77 (2003).CrossRefGoogle Scholar
  7. 7.
    Kazuo Sato, Mitsuhiro Shikida, Takashi Yamashiro, Kazuo Asaumi, Yasuroh Iriye, Masaharu Yamamoto, “Anisotropic etching rates of single-crystal silicon for TMAH water solution as a function of crystallographic orientation”, Sensors and Actuators A : Physical, Volume 73, Issues 1–2, pp. 131-137, (1999)Google Scholar
  8. 8.
    Kulwant Singh, Sanjeev K. Gupta, Amir Azam, J. Akhtar, “A wet-etch method with improved yield for realizing polysilicon resistors in batch fabrication of MEMS pressure sensor”, Sensor Review, Vol. 29 Iss: 3, pp.260 – 265 (2009).CrossRefGoogle Scholar

Copyright information

© Springer International Publishing Switzerland 2014

Authors and Affiliations

  • Kulwant Singh
    • 1
    • 2
  • Sualeh Akhtar
    • 3
  • Soney Varghese
    • 1
  • J. Akhtar
    • 2
  1. 1.Nanomaterials and Device Research Laboratory, School of Nano Science and TechnologyNIT-CalicutCalicutIndia
  2. 2.Sensors and Nanotechnology GroupCSIR-Central Electronics Engineering Research InstitutePilaniIndia
  3. 3.School of Information Technology and EngineeringVIT UniversityVelloreIndia

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