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A Dissipative-Particle-Dynamics Model for Simulating Dynamics of Charged Colloids

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High Performance Computing in Science and Engineering ‘13

Abstract

A mesoscopic colloid model is developed in which a spherical colloid is represented by many interacting sites on its surface. The hydrodynamic interactions with thermal fluctuations are taken accounts in full using Dissipative Particle Dynamics, and the electrostatic interactions are simulated using Particle–Particle–Particle Mesh method. This new model is applied to investigate the electrophoretic mobility of a charged colloid under an external electric field, and the influence of salt concentration and colloid charge are systematically studied. The simulation results show good agreement with predictions from the electrokinetic theory.

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Notes

  1. 1.

    http://reghanhill.research.mcgill.ca/research/mpek.html.

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Acknowledgements

We are grateful to Prof. Reghan Hill for providing the computer program MPEK. We thank the HLRS Stuttgart for a generous grant of computer time on HERMIT. This work is funded by the Deutsche Forschungsgemeinschaft (DFG) through the SFB-TR6 program “Physics of Colloidal Dispersions in External Fields”.

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Authors and Affiliations

  1. Institut für Physik, Johannes Gutenberg-Universität Mainz, Staudingerweg 7, 55099, Mainz, Germany

    Jiajia Zhou & Friederike Schmid

Authors
  1. Jiajia Zhou
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  2. Friederike Schmid
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Corresponding author

Correspondence to Friederike Schmid .

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Editors and Affiliations

  1. Zentrum für Informationsdienste und Hochleistungsrechnen (ZIH), Technische Universität Dresden, Dresden, Germany

    Wolfgang E. Nagel

  2. Abteilung für Angewandte Mathematik, Universität Freiburg, Freiburg, Germany

    Dietmar H. Kröner

  3. Höchstleistungsrechenzentrum Stuttgart (HLRS), Universität Stuttgart, Stuttgart, Germany

    Michael M. Resch

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Zhou, J., Schmid, F. (2013). A Dissipative-Particle-Dynamics Model for Simulating Dynamics of Charged Colloids. In: Nagel, W., Kröner, D., Resch, M. (eds) High Performance Computing in Science and Engineering ‘13. Springer, Cham. https://doi.org/10.1007/978-3-319-02165-2_1

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