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Unique Fabrication Method for Novel MEMS Micro-contact Structure

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MEMS and Nanotechnology, Volume 5

Abstract

Microelectromechanical systems (MEMS) switch reliability is a major obstacle for large-volume commercial applications despite offering lower power consumption, better isolation, and lower insertion loss compared to conventional field-effect transistors and PIN diodes (Yang et al. IEEE J Microelectromech Syst 18(2): 287–295, 2009). To enhance reliability and performance, MEMS researchers focus on the micro-contact lifecycle evolution based on material choice and design of the micro-contact. In order to examine the micro-contact phenomena and physics, a novel DC MEMS micro-contact structure has been developed. The structure is composed of a Gold contact pad and a layered Gold beam. The reliability and performance of a micro-contact is directly influenced by its ability to make and break its electrical connection. Its ability to separate from the contact area is a function of applied force, adhesion forces, and the restoring force. The layered Gold micro-contact structure was fabricated and the processing steps, performance, and experimental results of the device reliability of the device are presented.

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Acknowledgements

The authors would like to thank Lt Col L. Starman for his support and assistance with theory and analysis. The authors would also like to extend gratitude to AFIT technicians, Mr. Rich Johnston and Mr. Tom Stephenson for their work.

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Correspondence to Ronald Coutu Jr. .

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© 2014 The Society for Experimental Mechanics

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Toler, B., Danner, B., Langley, D., Coutu, R. (2014). Unique Fabrication Method for Novel MEMS Micro-contact Structure. In: Shaw III, G., Prorok, B., Starman, L., Furlong, C. (eds) MEMS and Nanotechnology, Volume 5. Conference Proceedings of the Society for Experimental Mechanics Series. Springer, Cham. https://doi.org/10.1007/978-3-319-00780-9_6

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  • DOI: https://doi.org/10.1007/978-3-319-00780-9_6

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  • Publisher Name: Springer, Cham

  • Print ISBN: 978-3-319-00779-3

  • Online ISBN: 978-3-319-00780-9

  • eBook Packages: EngineeringEngineering (R0)

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