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Warpage Measurement of Simulated Electronic Packaging Assembly

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  • First Online:
MEMS and Nanotechnology, Volume 5

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Abstract

Digital image correlation is an attractive displacement measurement method for thermo-mechanical characterization and simulation of electronic assemblies, but faces a number of challenges to implementation. In this paper, a batch reflow oven with a large window was used to allow for optical measurements of an assembly under simulated production reflow conditions, and the results were compared to those from a finite element model. The testing and modeling methods are described, and their results are compared.

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Acknowledgements

Thanks to Wade Hezeltine at Intel Corporation’s SMTD laboratory in Hillsboro, Oregon, for his idea to decrease the spacing of the window panes to reduce optical distortions.

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Authors and Affiliations

  1. Medtronic, Inc., 2343 W Medtronic Way, Tempe, AZ, USA

    Ningning Du & George F. Raiser

  2. Southern Research Institute, 757 Tom Martin Drive, Birmingham, AL, USA

    W. Carter Ralph

Authors
  1. Ningning Du
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  2. George F. Raiser
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  3. W. Carter Ralph
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Corresponding author

Correspondence to W. Carter Ralph .

Editor information

Editors and Affiliations

  1. NIST, Gaithersburg, Maryland, USA

    Gordon Shaw III

  2. Auburn University, Auburn, USA

    Barton C. Prorok

  3. Air Force Research Laboratory, Wright-Patterson AFB, Ohio, USA

    LaVern Starman

  4. Worcester Polytechnic Institute, Worcester, USA

    Cosme Furlong

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© 2014 The Society for Experimental Mechanics

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Du, N., Raiser, G.F., Ralph, W.C. (2014). Warpage Measurement of Simulated Electronic Packaging Assembly. In: Shaw III, G., Prorok, B., Starman, L., Furlong, C. (eds) MEMS and Nanotechnology, Volume 5. Conference Proceedings of the Society for Experimental Mechanics Series. Springer, Cham. https://doi.org/10.1007/978-3-319-00780-9_1

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  • DOI: https://doi.org/10.1007/978-3-319-00780-9_1

  • Published:

  • Publisher Name: Springer, Cham

  • Print ISBN: 978-3-319-00779-3

  • Online ISBN: 978-3-319-00780-9

  • eBook Packages: EngineeringEngineering (R0)

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