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Mixed Mode Fracture Behavior of Layered Plates

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Abstract

Layered architecture is used in applications such as thermal protection systems, body and vehicle armor etc. Layered materials are non homogeneous solids in which material properties vary in steps, leading to property jumps across the interface. The present study focuses on understating the mixed mode fracture behavior of layered plates in which elastic and fracture properties vary along the crack front. Single edge notched specimens, fabricated by joining Polymethylmethacrylate (PMMA) and Epoxy sheets using an Epoxy based adhesive (Araldite), were subjected to mixed mode loading. The thickness averaged stress intensity factor was determined through photoelasticity. A progressive mode of cracking was observed in which the crack initiated first in the Epoxy layer followed by crack initiation in the PMMA layer. The crack initiation angles were similar in both layers during the initial stages of crack growth. However, during the later stages the cracks in the two layers followed different paths with some amount of crack twisting. Similar experiments were also conducted under dynamic loading using a Hopkinson bar setup. High speed imaging was used to capture the dynamic phenomena. The effect of layering on the crack initiation toughness, crack speed and crack path were investigated.

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Acknowledgements

The authors would like to acknowledge the financial support under the FIST program by Department of Science and Technology, Government of India for the Ultra-high speed camera used in this study through grant number SR/FST/ETII-003/2006.

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Correspondence to Servesh Kumar Agnihotri .

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© 2014 The Society for Experimental Mechanics, Inc.

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Jacob, A.J., Agnihotri, S.K., Parameswaran, V. (2014). Mixed Mode Fracture Behavior of Layered Plates. In: Song, B., Casem, D., Kimberley, J. (eds) Dynamic Behavior of Materials, Volume 1. Conference Proceedings of the Society for Experimental Mechanics Series. Springer, Cham. https://doi.org/10.1007/978-3-319-00771-7_18

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  • DOI: https://doi.org/10.1007/978-3-319-00771-7_18

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  • Publisher Name: Springer, Cham

  • Print ISBN: 978-3-319-00770-0

  • Online ISBN: 978-3-319-00771-7

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