Skip to main content

Whisker Mitigation and Prevention

  • Chapter
  • First Online:
Factors Governing Tin Whisker Growth

Part of the book series: Springer Theses ((Springer Theses))

  • 583 Accesses

Abstract

There is currently no effective mitigation method to reliably eliminate Sn whiskers. One promising approach is to use conformal coatings. A conformal coating refers to an insulating protective coating that conforms to the shape and contour of the coated object.

In truth it matters less what we do in practice than how we do it and why we do it.

Donna Farhi.

This is a preview of subscription content, log in via an institution to check access.

Access this chapter

Chapter
USD 29.95
Price excludes VAT (USA)
  • Available as PDF
  • Read on any device
  • Instant download
  • Own it forever
eBook
USD 84.99
Price excludes VAT (USA)
  • Available as EPUB and PDF
  • Read on any device
  • Instant download
  • Own it forever
Softcover Book
USD 109.99
Price excludes VAT (USA)
  • Compact, lightweight edition
  • Dispatched in 3 to 5 business days
  • Free shipping worldwide - see info
Hardcover Book
USD 109.99
Price excludes VAT (USA)
  • Durable hardcover edition
  • Dispatched in 3 to 5 business days
  • Free shipping worldwide - see info

Tax calculation will be finalised at checkout

Purchases are for personal use only

Institutional subscriptions

References

  1. J.S. Kadesch, H. Leidecker, Effects of Conformal Coat on Tin Whisker Growth.EEE links, 6, No. 1, 20–22. http://nepp.nasa.gov/whisker/

  2. J.S. Kadesch, J. Brusse, The Continuing Dangers of Tin Whiskers and Attempts to Control Them with Conformal Coat. NASA’s EEE Links Newsletter (2001)

    Google Scholar 

  3. T.A. Woodrow, E.A. Ledbury, Evaluation of Conformal Coatings as a Tin Whisker Mitigation Strategy. in IPC/JEDEC 8th International Conference on Lead-Free Electronic Components and Assemblies, San Jose, CA, 18–20 Apr 2005

    Google Scholar 

  4. R. Schetty, Minimization of Tin whisker formation for lead-free electronics finishing. Circuit World 27, 17–20 (2001)

    Article  Google Scholar 

  5. C. Xu, Y. Zhang, C. Fan, J.A. Abys, Whisker Prevention, APEX. in Proceedings of the Technical Conference, S-18-3-1, California (2003)

    Google Scholar 

  6. S.C. Hsu, S.J. Wang, C.Y. Liu, Effect of Cu content on Interfacial Reactions Between Sn(Cu) Alloys and Ni/Ti Thin-Film Metallization. J. Electron. Mater. 32, 1214–1221 (2003)

    Article  ADS  Google Scholar 

  7. Q. Sun, Understanding and minimization of Tin Whiskers. in Partial fulfillments of requirements for course MatE, vol. 234, 800-14-0839 (2003)

    Google Scholar 

  8. P. Oberndorff, M. Dittes, P. Crema, S. Chopin, Whisker formation on matte Sn influencing of high humidity. in Proceedings 55th Electronic Components and Technology Conference, vol 1 (2005) pp. 429–433

    Google Scholar 

  9. B. Hampshire, L. Hymes, Shaving Tin Whiskers. Circuits Assembly, (2000) pp. 50–53

    Google Scholar 

  10. C.L. Rodekohr, M.J. Bozack, G.T. Flowers, J.C. Suhling, Influence of substrate surface roughness on Sn Whisker growth. Proceedings of the 54th IEEE Holm Conference on Electrical Contacts, October, 2008, p. 245

    Google Scholar 

  11. K.S. Kim, S.S. Kim, S.J. Kim, K. Suganuma, Prevention of Sn Whisker formation by surface treatment of Sn plating part II. in TMS Annual Meeting ISIR, Osaka University, Masanobu Tsujimoto, Isamu Yanad, C. Uyemura & Co., Ltd., (2008)

    Google Scholar 

  12. R.J. Landman, G. Davy, D.D. Fritz, Whisker-Impenetrable Metal Cap Process for Electronic Assemblies. Reliability Society Annual Technical Report (2010). (gdavy@ldfcoatings.com)

    Google Scholar 

  13. L. Reinbold, N. Jadhav, E. Chason, K. Sharvan Kumar, Relation of Sn Whisker formation to intermetallic growth: results from a Novel Sn-Cu “Bimetal Ledge Specimen”. J. Mater. Res. 24(12), 3583–3589 (2009)

    Article  ADS  Google Scholar 

  14. J.A. Thornton, D.W. Hoffman, Stress-related effects in thin films. Thin Solid Films 171, 5 (1989)

    Article  ADS  Google Scholar 

  15. C.E. Wicks, F.E. Block, Thermodynamic properties of 65 elements—Their oxides, halides, carbides, and Nitrides (U.S. Government Printing Office, Washington, 1963)

    Google Scholar 

Download references

Author information

Authors and Affiliations

Authors

Corresponding author

Correspondence to Erika R. Crandall .

Rights and permissions

Reprints and permissions

Copyright information

© 2013 Springer International Publishing Switzerland

About this chapter

Cite this chapter

Crandall, E.R. (2013). Whisker Mitigation and Prevention. In: Factors Governing Tin Whisker Growth. Springer Theses. Springer, Cham. https://doi.org/10.1007/978-3-319-00470-9_4

Download citation

Publish with us

Policies and ethics