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Environmental Effects on Whisker Growth

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Factors Governing Tin Whisker Growth

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Abstract

Since Sn oxidizes readily once deposited, oxygen exposure and the subsequent Sn oxides formed play a significant role in whisker growth. Many studies have demonstrated that Sn whisker growth is enhanced by exposure to oxygen and high relative humidity conditions [1, 2], especially near regions of surface corrosion.

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References

  1. P. Oberndorff, M. Dittes, P. Crema, P. Su, E. Yu, Humidity effects on sn whisker formation. IEEE Trans. Elect. Packag. Manuf. 29, 239–245 (2006)

    Article  Google Scholar 

  2. J.W. Osenbach, J.M. DeLucca, B.D. Potteiger, A. Amin, R.L. Shook, F.A. Baiocchi, Sn corrosion and its influence on Whisker growth. IEEE Trans. Electron. Packag. Manuf. 30, 23–35 (2007)

    Article  Google Scholar 

  3. P. Oberndorff, M. Dittes, P. Crema, S. Chopin, Whisker Formation on Matte Sn Influencing of High Humidity, in Proc. 55th Electronic Components and Technology Conf. 1 429–433 (2005)

    Google Scholar 

  4. P. Villars, L.D. Calvert, Pearson’s Handbook of Crystallographic Data for Intermetallic Phases (ASM International, Metals Park, OH, 1991)

    Google Scholar 

  5. S.W. Han, K.S. Kim, C.H. Yu, M. Osterman, M. Pecht, Observations of the spontaneous growth of tin whiskers in various reliability conditions, IEEE Electron. Components Technol. Conf. 1484–1490 (2008)

    Google Scholar 

  6. Purchased from Goodfellow Cambridge Limited, Ermine Business Park, Huntingdon, PE29 6WR, Units C1 & C2, England

    Google Scholar 

  7. C.L. Rodekohr, M.J. Bozack, G.T. Flowers, J.C. Suhling, Influence of Substrate Surface Roughness on Sn Whisker Growth, Proceedings of the 54th IEEE Holm Conference on Electrical Contacts, October, 245 (2008)

    Google Scholar 

  8. J.A. Thornton, D.W. Hoffman, Stress-related effects in thin films. Thin Solid Films 171, 5 (1989)

    Article  ADS  Google Scholar 

  9. P. Su, J. Howell, S. Chopin, A statistical study of sn whisker population and growth during elevated temperature and humidity storage tests. IEEE Trans. Electron. Packaging Manuf. 29, 246 (2006). 55th ECTC Workshop

    Article  Google Scholar 

  10. Standard Practice for Maintaining Constant Relative Humidity by Means of Aqueous Solutions, ASTM International, E 104–51 (2002)

    Google Scholar 

  11. L. Panashchenko, M. Osterman, Examination of Nickel Underlayer as a Tin Whisker Mitigator, 59th ECTC Conference, San Diego (2009) 8

    Google Scholar 

  12. H.L. Reynolds, J.W. Osenbach, G. Henshall, R.D. Parker, P. Su, Tin Whisker test development—temperature and humidity effects, Part I: experimental design, observations, and data collection. IEEE Tans. Electron. Packaging Manuf. 33, 1 (2010)

    Article  Google Scholar 

  13. K.N. Tu, Irreversible processes of spontaneous Whisker growth in Bimetallic Cu-Sn thin film reactions. Phys. Rev. B49, 2030–2034 (1994)

    ADS  Google Scholar 

  14. C.Y. Chang, R.W. Vook, The effect of surface aluminum oxide films on thermally induced hillock formation. Tin Solid Films 228, 205–209 (1993)

    Article  ADS  Google Scholar 

  15. R.K. Hart, The Thermal Oxidation of Tin, Proc. Phys. Soc., 65, PT. 12-B, (1952) 955

    Google Scholar 

  16. P. Su, M. Ding, S. Chopin, Effects of Reflow on the Microstructure and Whisker Growth Propensity of Sn Finish, Proceedings of the 55th ECTC 434–440 (2006)

    Google Scholar 

  17. B.Z. Lee, D.N. Lee, Spontaneous growth mechanism of tin Whiskers. Acta Metall. 46(10), 3701–3714 (1998)

    Google Scholar 

  18. N. Jadhav, E. Buchovecky, E. Chason, A. Bower, Real-time SEM/FIB studies of Whisker growth and surface modification. J. Metals 62, 30–37 (2010)

    Google Scholar 

  19. K.N. Tu, Electronic thin-film reliability (Cambridge University Press, New York, 2011)

    Google Scholar 

  20. W.J. Choi, T.Y. Lee, K.N. Tu, Structure and kinetics of Sn Whisker growth on Pb-free solder finish, IEEE Electron. Components Technol. Conf. 628–633 (2002)

    Google Scholar 

  21. Y. Nakadaira, S. Jeong, J. Shim, J. Seo, S. Min, T. Cho, S. Kang, S. Oh, Growth of tin Whiskers for lead-free plated leadframe packages in high humid environments and during thermal cycling. Microelectron. Reliab. 48, 83–104 (2008)

    Article  Google Scholar 

  22. S.S. Brenner, Strength of gold Whiskers. J. Appl. Phys. 30, 226–267 (1959)

    Article  ADS  Google Scholar 

  23. S.S. Brenner, Tensile strength of Whiskers. J. Appl. Phys. 27, 1484 (1956)

    Article  ADS  Google Scholar 

  24. K.W. Moon, C.E. Johnson, M.E. Williams, O. Kongstein, G.R. Stafford, C.A. Handwerker, W.J. Boettinger, Observed correlation of Sn oxide film to Sn Whisker growth in Sn-Cu electrodeposit for Pb-free solders. J. Elect. Mat. 34, L31–L33 (2005)

    Article  ADS  Google Scholar 

  25. K.F. Poulter, Effect of gas composition on vacuum measurement. J. Vac. Sci. Technol. A 2(2), 150 (1984)

    Article  ADS  Google Scholar 

  26. C.E. Wicks, F.E. Block, Thermodynamic properties of 65 Elements—their oxides, halides, carbides, and nitrides (U.S. Government Printing Office, Washington, 1963)

    Google Scholar 

  27. A. Maekawa, F. Okuyama, Nano and microcrystallites of gold grown by argon-ion bombardment. Surf. Sci. 481, L427–L432 (2001)

    Article  ADS  Google Scholar 

  28. A. Teverovsky, Introducing a new member to the family: gold Whiskers (Internal Memorandum, NASA Goddard Flight Center, 2003). April

    Google Scholar 

  29. M.J. Bozack, E.R. Crandall, C.L. Rodekohr, R.N. Dean, G.T. Flowers, J.C. Suhling, High lateral resolution auger electron spectroscopic (AES) measurements on high-aspect ratio Sn Whiskers on brass. IEEE Trans. Electron. Packag. Manuf. 33(3), 198–204 (2010)

    Article  Google Scholar 

  30. C.Y. Liu, C. Chen, K.N. Tu, Electromigration in Sn-Pb solder strips as a function of alloy composition. J. Appl. Phys. 88, 5703 (2000)

    Article  ADS  Google Scholar 

  31. A. Khosla, H.B. Huntington, Electromigration in tin single crystals. J. Phys. Chem. Solids 36(5), 395–399 (1975)

    Article  ADS  Google Scholar 

  32. S.H. Liu, C. Chen, P.C. Liu, T. Chou, Tin Whisker growth driven by electrical currents. J. Appl. Phys. 95(12), 7742–7747 (2004)

    Article  ADS  Google Scholar 

  33. Y.C. Hu, S.W. Wan, C.R. Kao, Electromigration in Tin Thin Film, Int’l Symposium on Electronic Materials and Packaging, IEEE Xplore 463–467 (2002)

    Google Scholar 

  34. Y.W. Lin, Y.S. Lai, Y.L. Lin, C.T. Tu, C.R. Kao, Tin Whisker growth induced by high electron current density. J. Elect. Mat. 37, 17–22 (2008)

    Article  ADS  Google Scholar 

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Correspondence to Erika R. Crandall .

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Crandall, E.R. (2013). Environmental Effects on Whisker Growth. In: Factors Governing Tin Whisker Growth. Springer Theses. Springer, Cham. https://doi.org/10.1007/978-3-319-00470-9_3

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