Abstract
The thickness of the deposited film has been thought to effect whisker growth. Since is it commonly agreed that compressive stress plays an important role in whisker formation, thicker Sn layers (~7 μm or greater) are thought to distribute the film stress over a larger volume, resulting in lower net stress values within the film.
I think physicists are the Peter Pans of the human race. They never grow up and they keep their curiosity.
I. I. Rabi.
Access this chapter
Tax calculation will be finalised at checkout
Purchases are for personal use only
References
P. Oberndorff, M. Dittes, L. Petit, C.C. Chen, J. Klerk, E.E. de Kluizenaar, Tin Whiskers on Lead-free Platings. Semiconductor Technology Symposium, Advanced packaging Technology, vol. 2 (2002), pp. 51–55
P. Oberndorff, M. Dittes, P. Crema, Whisker Testing: Reality or Fiction? in Proceedings of the IPC/Soldertec 2nd International Conference on Lead Free Electronics, Amsterdam (2004) CD-ROM
Purchased from Goodfellow Cambridge Limited, Ermine Business Park, Huntingdon, PE29 6WR, Units C1 & C2, England
J.A. Thornton, D.W. Hoffman, Internal stresses in Titanium, Nickel, Molybdenum, and Tantalum films deposited by cylindrical magnetron sputtering. J. Vac. Sci. Technol. 14(1), 166 (1977)
T.A. Woodrow, Tracer diffusion in whisker-prone tin platings, in Proceeding of STMA International Conference, Rosemont, IL, 24-28 September 2006
M.J. Bozack, E.R. Crandall, C.L. Rodekohr, R.N. Dean, G.T. Flowers, J.C. Suhling, High lateral resolution auger electron spectroscopic (AES) measurements on high-aspect ratio Sn whiskers on brass. IEEE Trans. Electron. Packag. Manuf. 33(3), 198–204 (2010)
Purchased from Ted Pella, Inc., PO Box 492477, Redding, CA 96049-2477
Purchased from Electron Microscopy Sciences, 1560 Industry Rd., Box 550 Hatfield, PA 19440
C. Xu, Y. Zhang, C. Fan, J. Abys, Understanding whisker phenomenon, Part II, competitive mechanisms, in Proceedings of the APEX Meeting, San Diego (2002)
Y. Zhang, C. Fan, C. Xu, O. Khaselev, J.A. Abys, Tin whisker growth: substrate effect understanding CTE mismatch and IMC formation. CircuiTree 7, 70–82 (2004)
Semiconductors on NSM, http://www.ioffe.ru/SVA/NSM/Semicond/index.html
The Engineering ToolBox, http://www.engineeringtoolbox.com/linear-expansion-coefficients-d_95.html
J.A. Thornton, D.W. Hoffman, Stress-related effects in thin films. Thin Solid Films 171, 5 (1989)
C.L. Rodekohr, M J. Bozack, G.T. Flowers, J.C. Suhling, Influence of substrate surface roughness on sn whisker growth, in Proceedings of the 54th IEEE Holm Conference on Electrical Contacts, October 2008, p 245
G.T. Galyon, C. Xu, S. Lal, B. Notohardjono, A. Frye, ECTC2005 iNEMI Tin Whisker Modeling Committee, iNEMI Tin Whisker Workshop, in IEEE Electronics Components Technology Conference, Lake Buena Vista, FL 2005
C. Xu, Y. Zhang, C. Fan, J.A. Abys, Understanding whisker phenomenon, the driving force for whisker formation. Circuitree 94–104 (2002)
B.Z. Lee, D.N. Lee, Spontaneous growth mechanism of tin whiskers. Acta Metall. 46(10), 3701–3714 (1998)
M. Zecchino, T. Cunningham, Thin Film Stress Measurement Using Dektak Stylus Profilers. (Veeco Instruments Inc., 2004)
T. Chudoba, N. Schwarzer, F. Richter, Determination of elastic properties of thin films by indentation measurements with a spherical indenter. Surf. Coat. Technol. 127, 9 (2000)
W.J. Boettinger, C.E. Johnson, L.A. Bendersky, K.W. Moon, M.E. Williams, G.R. Stafford, Whisker and Hillock formation on Sn, Sn-Cu and Sn-Pb electrodeposits. Acta Mater. 53, 5033–5050 (2005)
C.L. Rodekohr, G.T. Flowers, M.J. Bozack, R.N. Dean, R.L. Jackson, P. Lall, Influence of quantifiable extrinsic stresses on tin whisker growth, in Proceedings of the ASME International Design Engineering Technical Conferences and Computers and Information in Engineering Conference, IDETC/CIE, San Diego 2009
M.E. Thomas, M.P. Hartnett, J.E. McKay, The use of surface profilometers for the measurement of wafer curvature. J. Vac. Sci. Technol., A 6, 2570 (1988)
C.A. Handwerker, Tin whisker and surface defect formation of electrolplated films and reflowed joints, in CALCE Symposium on Part Reprocessing, Tin Whisker Mitigation, and Assembly Rework/Repair 2008
P. Bush, SUNY Buffalo from J. Brusse/Perot Syst, Some Examples of “Whiskers” from Tin-Based Alloys (2009), http://www.hlinstruments.com/RoHS_articles/Tin%20whiskers%20from%20tin%20alloy%20coatings.pdf
SWATCH Petition to EU TAC for RoHS Exemption (2006)
N. Asrar, O. Vancauwenberghe, S. Prangere, Whiskers from SnAg eutectic solder, tin whiskers formation on an electronic product: a case study. ASM Int (2007)
E. Chason, N. Jadhav, W. L. Chan, L Reinbold, and K. S. Kumar, Whisker formation in Sn and Pb-Sn Coatings: role of intermetallic growth, stress evolution, and plastic deformation processes. Appl. Phys. Lett. 92, 171901 (2008)
H. Leidecker, C. Greenwell, J. Brusse, Whiskers of Tin-Lead (Sn-Pb) on REFLOWED Die Attach Solder Used in the Manufacture of a Laser Diode Array. (NASA Goddard Space Flight Center and QSS Group, Inc., 2003), http://nepp.nasa.gov/whisker
J. Liang, N. Dariavach, D. Shangguan, Tin whisker nucleation and growth on Sn-Pb eutectic coating layer inside plated through holes with press-fit pins. IEEE Comp. Pack. Tech. 31, 1 (2008)
W. Zhangz, F. Schwager, Effects of lead on tin whisker elimination efforts toward lead-free and whisker-free electrodeposition of tin. J. Electrochem. Soc. 153, 5 (2006)
Author information
Authors and Affiliations
Corresponding author
Rights and permissions
Copyright information
© 2013 Springer International Publishing Switzerland
About this chapter
Cite this chapter
Crandall, E.R. (2013). Film/Substrate Effects on Whisker Growth. In: Factors Governing Tin Whisker Growth. Springer Theses. Springer, Cham. https://doi.org/10.1007/978-3-319-00470-9_2
Download citation
DOI: https://doi.org/10.1007/978-3-319-00470-9_2
Published:
Publisher Name: Springer, Cham
Print ISBN: 978-3-319-00469-3
Online ISBN: 978-3-319-00470-9
eBook Packages: Physics and AstronomyPhysics and Astronomy (R0)