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Simulation of Semiconductor Processes and Devices 2007 pp 205–208Cite as

Study of the Junction Depth Effect on Ballistic Current Using the Subband Decomposition Method

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Abstract

A robust algorithm to get the chemical potential of the particle reservoirs for the self consistent full 2D Schrödinger-Poisson solver is proposed. Using this algorithm we study the effect of junction depth on ballistic current. Simulation results show that shallow junctions come with much better on to off current ratio while it keeps the on-state transconductance at the same level as the deeper junction device.

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References

  1. E. Polizzi, N. Ben Abdallah, Subband decomposition approach for the simulation of quantum electron transport in nanostructures, Journal of Computational Physics 22. 150–180 (2005).

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  2. Craig S. Lent and David J. Kirkner, The quantum transmitting boundary method. Journal of Applied Physics 67. 6353 (1990).

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Authors and Affiliations

  1. IMEC, Kapeldreef 75, B-3001, Leuven, Belgium

    M. Ali. Pourghaderi, Bart Sorée, Marc Meuris, Marc Heyns & Kristin De Meyer

  2. Physics Dept., Universiteit Antwerpen, Groenenborgerlaan 171, B-2020, Antwerpen, Belgium

    Wim Magnus

  3. INSYS, Katholieke Universiteit Leuven, Kasteelpark Arenberg 10, B-3001, Leuven, Belgium

    M. Ali. Pourghaderi, Marc Heyns & Kristin De Meyer

Authors
  1. M. Ali. Pourghaderi
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  2. Wim Magnus
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  3. Bart Sorée
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  4. Marc Meuris
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  5. Marc Heyns
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  6. Kristin De Meyer
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Editor information

Editors and Affiliations

  1. Institut für Mikroelektronik, Technische Universität Wien, Vienna, Austria

    Tibor Grasser  & Siegfried Selberherr  & 

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© 2007 Springer-Verlag Wien

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Pourghaderi, M.A., Magnus, W., Sorée, B., Meuris, M., Heyns, M., De Meyer, K. (2007). Study of the Junction Depth Effect on Ballistic Current Using the Subband Decomposition Method. In: Grasser, T., Selberherr, S. (eds) Simulation of Semiconductor Processes and Devices 2007. Springer, Vienna. https://doi.org/10.1007/978-3-211-72861-1_49

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  • DOI: https://doi.org/10.1007/978-3-211-72861-1_49

  • Publisher Name: Springer, Vienna

  • Print ISBN: 978-3-211-72860-4

  • Online ISBN: 978-3-211-72861-1

  • eBook Packages: EngineeringEngineering (R0)

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