Skip to main content

A Multiple Compatible Compression Scheme Based on Tri-state Signal

  • Conference paper
  • First Online:
Urban Intelligence and Applications

Part of the book series: Studies in Distributed Intelligence ((SDI))

  • 257 Accesses

Abstract

A novel test data compression scheme based on the tri-state signal is proposed to solve the problem of increasing embedded chip test data in the development of Smart City. Firstly, partial inputs reduction is performed on the test set, and the don’t care bits proportion is improved by merging the test patterns with a high bit ratio so that the compatibility of each test pattern is improved. After using the inputs reduction technology, using the characteristics of the tri-state signal, the test set is divided into several sub-segments and uses the tri-state signal to compress the sub-segments with compatible coding, and the compression rate of the test set is improved by considering multiple compatible rules. The experimental results show that compared with the previous work results, the proposed scheme achieves a good compression ratio, the average test compression ratio can reach 82.15%. At the same time, the test power and area overhead are not significantly improved.

This is a preview of subscription content, log in via an institution to check access.

Access this chapter

Chapter
USD 29.95
Price excludes VAT (USA)
  • Available as PDF
  • Read on any device
  • Instant download
  • Own it forever
eBook
USD 169.00
Price excludes VAT (USA)
  • Available as EPUB and PDF
  • Read on any device
  • Instant download
  • Own it forever
Softcover Book
USD 219.99
Price excludes VAT (USA)
  • Compact, lightweight edition
  • Dispatched in 3 to 5 business days
  • Free shipping worldwide - see info
Hardcover Book
USD 219.99
Price excludes VAT (USA)
  • Durable hardcover edition
  • Dispatched in 3 to 5 business days
  • Free shipping worldwide - see info

Tax calculation will be finalised at checkout

Purchases are for personal use only

Institutional subscriptions

References

  1. S. Mirthulla, A. Arulmurugan, Improvement of test data compression using combined encoding, in International Conference on Electronics and Communication Systems (ICECS) (2015), pp. 635–638

    Google Scholar 

  2. S. Seo, Y. Lee, S. Kang, Tri-state coding using reconfiguration of twisted ring counter for test data compression. IEEE Trans. Comput.-Aided Des. Integr. Circ. Syst. 35(2), 274–284 (2016)

    Article  Google Scholar 

  3. J. Nicolai, Integrated circuit with mode detection pin for tristate level detection, U.S. Patent 5198707 (1993)

    Google Scholar 

  4. D. Thomson, P. Sheridan, J. Cleary, Tri-state input detection circuit. U.S. Patent: 6133753 (2000)

    Google Scholar 

  5. C.A. Chen, S.K. Gupta, Efficient BIST TPG design and test cube compaction via input reduction. IEEE Trans. Comput.-Aided Des. Integr. Circ. Syst. 17(8), 692–705 (2002)

    Article  Google Scholar 

  6. K.M. Butler, J. Saxena, A. Jain, T. Fryars, Minimizing power consumption in scan testing: pattern generation and DFT techniques, in International Conference on Test (2004), pp.355–364

    Google Scholar 

  7. A. Chandra, K. Chakrabarty, System-on-a-chip test-data compression and decompression architectures based on Golomb codes. IEEE Trans. Comput.-Aided Des. Integr. Circ. Syst. 20(3), 335–368 (2001)

    Article  Google Scholar 

  8. A. Chandra, K. Chakrabarty, Test data compression and test resource partitioning for system-on-a-chip using frequency-directed run-length (FDR) codes. IEEE Trans. Comput. 52(8), 1076–1088 (2003)

    Article  Google Scholar 

  9. P.T. Gonciari, B.M. Al-Hashimi, Variable-length input Huffman coding for system-on-a-chip test. IEEE Trans. Comput.-Aided Des. Integr. Circ. Syst. 22(6), 783–796 (2003)

    Article  Google Scholar 

  10. A.H. El-Maleh, Test data compression for system-on-a-chip using extended frequency-directed run-length (EFDR) code. IET Comput. Digit. Tech. 2(3), 155–163 (2008)

    Article  Google Scholar 

  11. T. Chen, X. Yi, W. Wang, J. Liu, H. Liang, F. Ren, Low power multistage test data compression scheme. Acta Electron. Sin. 45(6), 1384–1387 (2017)

    Google Scholar 

  12. K. Ji-shun, L. Jie-tang, Z. Liang, Test data compression method for multiple scan chain based on mirror-symmetrical reference slices. J. Electron. Inf. Technol. 37(6), 1514–1518 (2015)

    Google Scholar 

  13. K.A. Bhavsar, U.S. Mehta, Analysis of don’t care bits filling techniques for optimization of compression and scan power. Int. J. Comput. Appl. 18(3), 887–975 (2011)

    Google Scholar 

  14. W. Zhan, A. EL-Maleh, A new collaborative scheme of test vector compression based on equal-run-length coding (ERLC), in International Conference on Computer Supported Cooperative Work in Design (2009), pp. 21–25

    Google Scholar 

  15. R. Sankaralingam, R.R. Oruganti, N.A. Touba, Static compaction techniques to control scan vector power dissipation, in Proceedings of IEEE VLSI Test Symposium (VTS) (2000), pp. 35–40

    Google Scholar 

Download references

Acknowledgements

This work sponsored by: The Key Program of the National Natural Science Foundation of China (Grant No. 61432004); The National Natural Science Foundation of China (Grant No.61474035, No.61204046, No.61502140); NSFC-Shenzhen Joint Foundation (Key Project) (Grant No.U1613217).

Author information

Authors and Affiliations

Authors

Corresponding author

Correspondence to Tian Chen .

Editor information

Editors and Affiliations

Rights and permissions

Reprints and permissions

Copyright information

© 2020 Springer Nature Switzerland AG

About this paper

Check for updates. Verify currency and authenticity via CrossMark

Cite this paper

Chen, T., Zuo, Y., An, X., Ren, F. (2020). A Multiple Compatible Compression Scheme Based on Tri-state Signal. In: Yuan, X., Elhoseny, M. (eds) Urban Intelligence and Applications. Studies in Distributed Intelligence . Springer, Cham. https://doi.org/10.1007/978-3-030-45099-1_2

Download citation

  • DOI: https://doi.org/10.1007/978-3-030-45099-1_2

  • Published:

  • Publisher Name: Springer, Cham

  • Print ISBN: 978-3-030-45098-4

  • Online ISBN: 978-3-030-45099-1

  • eBook Packages: Computer ScienceComputer Science (R0)

Publish with us

Policies and ethics