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Methodology and Best-Practice Guidelines for Thermally Optimized Driver Design

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Part of the book series: Mathematics in Industry ((TECMI,volume 29))

Abstract

An important outcome of the validation activities is the formulation of methodologies to address coupled problems in EDA. This chapter describes typical coupled problems arising in the field of activities of the industrial partners. It also highlights the challenges and makes the link to some test cases. In order to address these challenges and solve the design problems illustrated by the test cases, several design flows were put in place based on outcomes of the project activities. We describes these flows as well as the tools set-up in order to support them. Finally, the recommended usage of these flows is proposed.

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Correspondence to Renaud Gillon .

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Gillon, R. et al. (2019). Methodology and Best-Practice Guidelines for Thermally Optimized Driver Design. In: ter Maten, E., Brachtendorf, HG., Pulch, R., Schoenmaker, W., De Gersem, H. (eds) Nanoelectronic Coupled Problems Solutions. Mathematics in Industry(), vol 29. Springer, Cham. https://doi.org/10.1007/978-3-030-30726-4_23

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