Abstract
This paper proposes a method for identifying the coefficient of thermal expansion of dissimilar materials. Dissimilar materials are simulating on an electronic packaging. Displacement data used for inverse analysis are obtained by digital image correlation which is a method for measuring displacement in the full field of view without contact. The virtual fields method based on the principle of virtual work is employed as a method for inverse analysis. Each coefficient of thermal expansion that is unknown parameters is determined by preparing virtual displacements as many as the number of unknowns. The effectiveness of the inverse analysis method is demonstrated by identifying the coefficients of thermal expansion of dissimilar materials. Results show that the coefficient of thermal expansion can be obtained by the proposed method.
This is a preview of subscription content, log in via an institution to check access.
Access this chapter
Tax calculation will be finalised at checkout
Purchases are for personal use only
References
A. Khalilollahi, W. Russell, L.O. Onipede, Thermal Reliability Design and Optimization for Multilayer Composite Electronic Boards (ASME, International Mechanical Engineering Congress and Exposition, New York, 2005), pp. 845–851
M. Grédiac, F. Pierron, A. Vautrin, The iosipescu in-plane shear test applied to composites: a new approach based on displacement field processing. Compos. Sci. Technol. 51(3), 409–417 (1994)
M.A. Sutton, J.H. Yan, S. Avril, F. Pierron, S.M. Adeeb, Identification of heterogeneous constitutive parameters in a welded specimen: uniform stress and virtual fields methods for material property estimation. Exp. Mech. 48(4), 451–464 (2008)
M. Grédiac, F. Pierron, Identifying constitutive parameters from heterogeneous strain fields using the virtual fields method. Proc. IUTAM 4, 48–53 (2012)
Y. Sato, S. Arikawa, S. Yoneyama, Identification of elastic material characteristics of dissimilar materials by virtual fields method (in Japanese). J. JSEM 14, 250–256 (2014)
S. Yoneyama, Basic principle of digital image correlation for inplane displacement and strain measurement. Adv. Compos. Mater. 25, 105–123 (2015)
M. Grédiac, F. Pierron, S. Avril, E. Toussaint, The virtual fields method for extracting constitutive parameters from full-field measurements: a review. Strain 42, 233–253 (2006)
S. Yoneyana, P.G. Ifju, S.E. Rohde, Identifying through-thickness material properties of carbon-fiber-reinforced plastics using the virtual fields method combined with moiré interferometry. Adv. Compos. Mater. 27, 1–17 (2018)
D.J. Segalman, D.B. Woyak, R.E. Rowlands, Smooth spline-like finite element differentiation of full-field experimental data over arbitrary geometry. Exp. Mech. 19, 429–437 (1979)
Author information
Authors and Affiliations
Corresponding author
Editor information
Editors and Affiliations
Rights and permissions
Copyright information
© 2020 Society for Experimental Mechanics, Inc.
About this paper
Cite this paper
Kanai, Y., Arikawa, S., Yoneyama, S., Fujimoto, Y. (2020). Evaluating the Coefficient of Thermal Expansion of Electronic Board Using the Virtual Fields Method. In: Baldi, A., Kramer, S., Pierron, F., Considine, J., Bossuyt, S., Hoefnagels, J. (eds) Residual Stress, Thermomechanics & Infrared Imaging and Inverse Problems, Volume 6. Conference Proceedings of the Society for Experimental Mechanics Series. Springer, Cham. https://doi.org/10.1007/978-3-030-30098-2_12
Download citation
DOI: https://doi.org/10.1007/978-3-030-30098-2_12
Published:
Publisher Name: Springer, Cham
Print ISBN: 978-3-030-30097-5
Online ISBN: 978-3-030-30098-2
eBook Packages: EngineeringEngineering (R0)