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International Conference on Embedded Computer Systems

SAMOS 2019: Embedded Computer Systems: Architectures, Modeling, and Simulation pp 184–196Cite as

An Open-Hardware Platform for MPSoC Thermal Modeling

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Part of the book series: Lecture Notes in Computer Science ((LNTCS,volume 11733))

Abstract

Current integrated circuits exhibit an impressive and increasing power density. In this scenario, thermal modelling plays a key role in the design of next generation cooling and thermal management solutions. However, extending existing thermal models, or designing new ones to account for new cooling solutions, requires parameter identification as well as a validation phase to ensure correctness of the results. In this paper, we propose a flexible solution to the validation issue, in the form of a hardware platform based on a Thermal Test Chip (TTC). The proposed platform allows to test a heat dissipation solution under realistic conditions, including fast spatial and temporal power gradients as well as hot spots, while collecting a temperature map of the active silicon layer. The combined power/temperature map is the key input to validate a thermal model, in both the steady state and transient case. This paper presents the current development of the platform, and provides a first validation dataset for the case of a commercial heat sink.

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Notes

  1. 1.

    https://doi.org/10.5281/zenodo.2871796.

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Acknowledgements

The work has been partially supported by the H2020 project RECIPE (GA 801137).

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Authors and Affiliations

  1. DEIB, Politecnico di Milano, Milan, Italy

    Federico Terraneo, Alberto Leva & William Fornaciari

Authors
  1. Federico Terraneo
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  2. Alberto Leva
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  3. William Fornaciari
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Corresponding author

Correspondence to Federico Terraneo .

Editor information

Editors and Affiliations

  1. Technical University of Crete and ICS - FORTH, Chania, Greece

    Dionisios N. Pnevmatikatos

  2. INSA Rennes, Rennes Cedex 7, France

    Maxime Pelcat

  3. Fraunhofer IESE, Kaiserslautern, Germany

    Matthias Jung

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Terraneo, F., Leva, A., Fornaciari, W. (2019). An Open-Hardware Platform for MPSoC Thermal Modeling. In: Pnevmatikatos, D., Pelcat, M., Jung, M. (eds) Embedded Computer Systems: Architectures, Modeling, and Simulation. SAMOS 2019. Lecture Notes in Computer Science(), vol 11733. Springer, Cham. https://doi.org/10.1007/978-3-030-27562-4_13

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  • DOI: https://doi.org/10.1007/978-3-030-27562-4_13

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  • Publisher Name: Springer, Cham

  • Print ISBN: 978-3-030-27561-7

  • Online ISBN: 978-3-030-27562-4

  • eBook Packages: Computer ScienceComputer Science (R0)

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