Abstract
C/SiC composite is one kind of the continuous fiber-reinforced ceramic composite (CFCC), with carbon fiber and SiC matrix. Due to its advantages such as specific stiffness, thermal stability, and the advantages of being able to form a complex structure in one piece, C/SiC has received wide attention in the aerospace field in recent years. In order to meet the high thermal stability requirements of the main bearing structure of space optical remote sensor, this chapter proposes an integrated main bearing structure scheme for an off-axis TMA space mapping camera. This structure is a frame-skin configuration, with an outer profile of 1.8 m × 0.9 m × 1.3 m and a weight of 110 kg. Different from the traditional split-type structure, this product adopts integral molding design, which reduces the weight and greatly improves the structural rigidity and the thermal stability. First, using carbon fiber cloth to make integrated preforms by three-dimensional weaving and stitching, then adding SiC matrix by chemical vapor infiltration (CVI). This chapter introduces the optimization design and FEA analysis method and manufacturing of the entire product. The chapter also introduces the thermal stability experiment. The product is wrapped by multilayer insulation components, and several temperature fields are applied through film resistance heater. The displacement and angle change of each mirror mounting interface are measured by laser dual-frequency interferometer. On analysis of the experimental data, the macroscopic coefficient of the product is found to be 0.73E−6/°C, and the experiment results are in good agreement with the simulation analysis. This product can meet the requirements of thermal stability. Compared to conventional metal or resin-based composite materials, the C/SiC has great advantage.
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Sun, L., Nian, H., Song, Z., Ding, Y. (2020). Research on the Thermal Stability of Integrated C/SiC Structure in Space Camera. In: Urbach, H., Yu, Q. (eds) 5th International Symposium of Space Optical Instruments and Applications. ISSOIA 2018. Springer Proceedings in Physics, vol 232. Springer, Cham. https://doi.org/10.1007/978-3-030-27300-2_21
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DOI: https://doi.org/10.1007/978-3-030-27300-2_21
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