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Thermal Fracture of Advanced Materials Based on Fourier Heat Conduction

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Advanced Thermal Stress Analysis of Smart Materials and Structures

Part of the book series: Structural Integrity ((STIN,volume 10))

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Abstract

In this chapter, we introduce a so-called extended displacement discontinuity approach to deal with three-dimensional (3D) thermoelastic plane crack problems in advanced materials.

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Authors and Affiliations

  1. Department of Mechanical Engineering, University of Alberta, Edmonton, Canada

    Prof. Dr. Zengtao Chen

  2. Department of Bioresource Engineering, McGill University, Island of Montreal, QC, H9X 3V9, Canada

    Dr. Abdolhamid Akbarzadeh

  3. Department of Mechanical Engineering, McGill University, Montreal, QC, H3A 0C3, Canada

    Dr. Abdolhamid Akbarzadeh

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  1. Prof. Dr. Zengtao Chen
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  2. Dr. Abdolhamid Akbarzadeh
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Correspondence to Zengtao Chen .

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Chen, Z., Akbarzadeh, A. (2020). Thermal Fracture of Advanced Materials Based on Fourier Heat Conduction. In: Advanced Thermal Stress Analysis of Smart Materials and Structures. Structural Integrity, vol 10. Springer, Cham. https://doi.org/10.1007/978-3-030-25201-4_5

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  • DOI: https://doi.org/10.1007/978-3-030-25201-4_5

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