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Advanced Thermal Stress Analysis of Smart Materials and Structures pp 119–170Cite as

Coupled Thermal Stresses in Advanced Smart Materials

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Part of the book series: Structural Integrity ((STIN,volume 10))

Abstract

Besides being the snack of choice of the Chinese Giant panda, the bamboo plant also represents a near-perfect natural example of a functionally graded material.

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Author information

Authors and Affiliations

  1. Department of Mechanical Engineering, University of Alberta, Edmonton, Canada

    Prof. Dr. Zengtao Chen

  2. Department of Bioresource Engineering, McGill University, Island of Montreal, QC, H9X 3V9, Canada

    Dr. Abdolhamid Akbarzadeh

  3. Department of Mechanical Engineering, McGill University, Montreal, QC, H3A 0C3, Canada

    Dr. Abdolhamid Akbarzadeh

Authors
  1. Prof. Dr. Zengtao Chen
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  2. Dr. Abdolhamid Akbarzadeh
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Correspondence to Zengtao Chen .

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Chen, Z., Akbarzadeh, A. (2020). Coupled Thermal Stresses in Advanced Smart Materials. In: Advanced Thermal Stress Analysis of Smart Materials and Structures. Structural Integrity, vol 10. Springer, Cham. https://doi.org/10.1007/978-3-030-25201-4_4

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  • DOI: https://doi.org/10.1007/978-3-030-25201-4_4

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  • Publisher Name: Springer, Cham

  • Print ISBN: 978-3-030-25200-7

  • Online ISBN: 978-3-030-25201-4

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