Abstract
Deep learning is replacing many traditional machine vision techniques. However, defect inspection systems still rely on traditional methods due to difficulties in obtaining training data and the absence of color images. Thus, overall performance heavily depends on individual human skill in tuning hundreds of parameters. This paper presents a defect inspection technique using a defect probability image (DPI) and a deep convolutional neural network (CNN). DPIs are the estimated probability of a defect in given image and can be obtained from traditional inspection techniques. The DPI and gray image are stacked as input to the CNN. Performance was compared with a conventional CNN model using RGB or grayscale images, and ViDi, an artificial intelligence software for industry. The proposed method outperforms the other methods, works well on small dataset, and removes the requirement for human skill.
Access this chapter
Tax calculation will be finalised at checkout
Purchases are for personal use only
References
Abadi, M., et al.: TensorFlow: large-scale machine learning on heterogeneous systems (2015). Software https://www.tensorflow.org/
Abbott, G., Fouquet, C., Tadmor, O., Tada, T.: Use of design information and defect image information in defect classification. US Patent 8,175,373, 8 May 2012
Ak, R., Ferguson, M., Lee, Y.T.T., Law, K.H.: Automatic localization of casting defects with convolutional neural networks. In: 2017 IEEE International Conference on Big Data (BigData 2017) (2017)
Bai, X., Fang, Y., Lin, W., Wang, L., Ju, B.F.: Saliency-based defect detection in industrial images by using phase spectrum. IEEE Trans. Industr. Inf. 10(4), 2135–2145 (2014)
COGNEX: Vidi suite (2.0) (2018). https://www.cognex.com/products/machine-vision/deep-learning-based-software
Damien, A., et al.: TFlearn (2016). https://github.com/tflearn/tflearn
Haddad, B.M., Yang, S., Karam, L.J., Ye, J., Patel, N.S., Braun, M.W.: Multifeature, sparse-based approach for defects detection and classification in semiconductor units. IEEE Trans. Autom. Sci. Eng. (2016)
Hayakawa, K., et al.: Semiconductor defect classifying method, semiconductor defect classifying apparatus, and semiconductor defect classifying program. US Patent 8,595,666, 26 November 2013
Jansen, S., Florence, G., Perry, A., Fox, S.: Utilizing design layout information to improve efficiency of SEM defect review sampling. In: IEEE/SEMI Advanced Semiconductor Manufacturing Conference, ASMC 2008, pp. 69–71. IEEE (2008)
Lv, Y., Duan, Y., Kang, W., Li, Z., Wang, F.Y.: Traffic flow prediction with big data: a deep learning approach. IEEE Trans. Intell. Transp. Syst. 16(2), 865–873 (2015)
Nakazawa, T., Kulkarni, D.V.: Wafer map defect pattern classification and image retrieval using convolutional neural network. IEEE Trans. Semicond. Manuf. 31(2), 309–314 (2018)
Pastor-López, I., Santos, I., Santamaría-Ibirika, A., Salazar, M., de-la Pena-Sordo, J., Bringas, P.G.: Machine-learning-based surface defect detection and categorisation in high-precision foundry. In: 2012 7th IEEE Conference on Industrial Electronics and Applications (ICIEA), pp. 1359–1364. IEEE (2012)
Simonyan, K., Zisserman, A.: Very deep convolutional networks for large-scale image recognition. arXiv preprint arXiv:1409.1556 (2014)
Tan, S.C., Watada, J., Ibrahim, Z., Khalid, M.: Evolutionary fuzzy artmap neural networks for classification of semiconductor defects. IEEE Trans. Neural Netw. Learn. Syst. 26(5), 933–950 (2015)
Tsai, D.M., Lin, C.T., Chen, J.F.: The evaluation of normalized cross correlations for defect detection. Pattern Recogn. Lett. 24(15), 2525–2535 (2003)
Wang, C.C., Jiang, B.C., Lin, J.Y., Chu, C.C.: Machine vision-based defect detection in IC images using the partial information correlation coefficient. IEEE Trans. Semicond. Manuf. 26(3), 378–384 (2013)
Author information
Authors and Affiliations
Corresponding author
Editor information
Editors and Affiliations
Rights and permissions
Copyright information
© 2019 Springer Nature Switzerland AG
About this paper
Cite this paper
Jang, C., Yun, S., Hwang, H., Shin, H., Kim, S., Park, Y. (2019). A Defect Inspection Method for Machine Vision Using Defect Probability Image with Deep Convolutional Neural Network. In: Jawahar, C., Li, H., Mori, G., Schindler, K. (eds) Computer Vision – ACCV 2018. ACCV 2018. Lecture Notes in Computer Science(), vol 11361. Springer, Cham. https://doi.org/10.1007/978-3-030-20887-5_9
Download citation
DOI: https://doi.org/10.1007/978-3-030-20887-5_9
Published:
Publisher Name: Springer, Cham
Print ISBN: 978-3-030-20886-8
Online ISBN: 978-3-030-20887-5
eBook Packages: Computer ScienceComputer Science (R0)