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Investigation of Bioplastics for Additive Manufacturing

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Advances in Additive Manufacturing, Modeling Systems and 3D Prototyping (AHFE 2019)

Part of the book series: Advances in Intelligent Systems and Computing ((AISC,volume 975))

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Abstract

Additive manufacturing (AM) has been growing in interest due to its non-traditional approach to producing objects by which components are fabricated directly from computer models by selectively depositing and consolidating or curing raw materials in successive layers. Currently, most polymer AM processes are limited by a narrow field of available and compatible materials. Typical thermoplastics common to the injection molding industry are created from petroleum, a limited and nonrenewable resource and have been widely adopted for use in AM. Recently plastics that are more sustainable, such as polylactic acid (PLA), have started to gain traction as a competitor to these traditional plastics. For this study, cellulose acetate butyrate (CAB), cellulose acetate propionate (CAP), hydroxypropyl cellulose (HPC), nylon 11, and polycaprolactone (PCL) were formulated and tested for AM. In addition, ABS and PLA were tested as control materials. Results showed the technical feasibility of some bioplastics for AM.

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Authors and Affiliations

  1. Department of Forest Biomaterials, North Carolina State University, Raleigh, USA

    Daniel Saloni & Nicole Mervine

Authors
  1. Daniel Saloni
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  2. Nicole Mervine
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Correspondence to Daniel Saloni .

Editor information

Editors and Affiliations

  1. Architecture Department, University of Chieti-Pescara, Pescara, Pescara, Italy

    Massimo Di Nicolantonio

  2. Emilio Rossi Design Consulting, Ortona, Chieti, Italy

    Emilio Rossi

  3. Bonn, Nordrhein-Westfalen, Germany

    Thomas Alexander

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Saloni, D., Mervine, N. (2020). Investigation of Bioplastics for Additive Manufacturing. In: Di Nicolantonio, M., Rossi, E., Alexander, T. (eds) Advances in Additive Manufacturing, Modeling Systems and 3D Prototyping. AHFE 2019. Advances in Intelligent Systems and Computing, vol 975. Springer, Cham. https://doi.org/10.1007/978-3-030-20216-3_34

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  • DOI: https://doi.org/10.1007/978-3-030-20216-3_34

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  • Publisher Name: Springer, Cham

  • Print ISBN: 978-3-030-20215-6

  • Online ISBN: 978-3-030-20216-3

  • eBook Packages: EngineeringEngineering (R0)

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