Abstract
In this chapter, we investigate vertical transistors based on hot electron transport—tunneling hot electron transfer amplifier (THETA). As compared to lateral transport devices such as HEMTs, electron transport can be defined by heterojunction growth at a scale shorter than 10 nm, and output conductance can be controlled through doping and epitaxial engineering. Furthermore, the power dissipation in a vertical device occurs over a volume rather than in a 2D sheet; the local temperature rise is not as significant as in the lateral case. THETA had been previously demonstrated in GaAs systems, and current gain in excess of 10 had been achieved with wide bandgap AlSbAs emitter at room temperature. GaN THETA has been reported in recent years, but the current gain in these devices has remained relatively low.
We demonstrate GaN THETA operating with common-emitter current gain above 10 for the first time by implementing polarization-engineered barriers in the emitter-base and base-collector junctions. Hot electron spectrometry and ballistic electron reflection in THETA were observed with the evidence of electron energy distribution and room temperature negative differential resistance (NDR). The electron-electron and coupled plasmon-phonon scatterings are key factors for the hot electron energy relaxation and broadening in base, in accordance with Monte Carlo simulation. Shrinking base thickness will reduce scattering rates and thereby increase current gain. Small signal model suggests above 200 GHz ft can be expected with a current density above 500 kA/cm2, base thickness of 5 nm and base doping of 2E20 cm2 for device mesa area less than 5 μm2.
For future work, optimizing of design to suppress output conductance and advanced processing technology to reduce parasitic components will enable highly scaled THETA for high-frequency operation.
Access this chapter
Tax calculation will be finalised at checkout
Purchases are for personal use only
References
U.K. Mishra, L. Shen, T.E. Kazior, Y.-F. Wu, GaN-based RF power devices and amplifiers. Proc. IEEE 96(2), 287–305 (2008)
Y.-F. Wu, D. Kapolnek, J.P. Ibbetson, P. Parikh, B.P. Keller, U.K. Mishra, Very-high power density AlGaN/GaN HEMTs. IEEE Trans Electr Devices 48(3), 586–590 (2001)
J. Kuzmík, Power electronics on InAlN/(In) GaN: Prospect for a record performance. IEEE Electr Device Letters 22(11), 510–512 (2001)
S. Nakamura, T. Mukai, M. Senoh, Candela-class high-brightness InGaN/AlGaN double-heterostructure blue-light-emitting diodes. Appl. Phys. Lett. 64(13), 1687–1689 (1994)
S. Pimputkar, J.S. Speck, S.P. DenBaars, S. Nakamura, Prospects for LED lighting. Nat. Photonics 3(4), 180 (2009)
G. Martin et al., Valence-band discontinuity between GaN and AlN measured by x-ray photoemission spectroscopy. Appl. Phys. Lett. 65(5), 610–612 (1994)
N. Nepal, J. Li, M.L. Nakarmi, J.Y. Lin, H.X. Jiang, Temperature and compositional dependence of the energy band gap of AlGaN alloys. Appl. Phys. Lett. 87(24), 242104 (2005)
T.P. Chow, R. Tyagi, Wide bandgap compound semiconductors for superior high-voltage unipolar power devices. IEEE Trans Electr Devices 41(8), 1481–1483 (1994)
Y. Yuanzheng et al., InAlN/AlN/GaN HEMTs With Regrown Ohmic Contacts and <formula formulatype="inline"> <img src="/images/tex/20391.gif" alt="f_{T}"> </formula> of 370 GHz. IEEE Electr Device Letters 33(7), 988–990 (2012)
U.K. Mishra, P. Parikh, W. Yi-Feng, AlGaN/GaN HEMTs-an overview of device operation and applications. Proc. IEEE 90(6), 1022–1031 (2002)
T. Yan et al., Ultrahigh-speed GaN high-electron-mobility transistors With <inline-formula> <img src="/images/tex/27762.gif" alt="f_{T}/f_{math\rm {\max }}"> </inline-formula> of 454/444 GHz. IEEE Electr Device Letters 36(6), 549–551 (2015)
J.B. Khurgin, D. Jena, Y.J. Ding, Isotope disorder of phonons in GaN and its beneficial effect on high power field effect transistors. Appl. Phys. Lett. 93(3), 032110-1-032110-3 (2008)
F. Tian, W. Ronghua, X. Huili, S. Rajan, D. Jena, Effect of optical phonon scattering on the performance of GaN transistors. IEEE Electr Device Letters 33(5), 709–711 (2012)
S. Dasgupta, A. Nidhi, J. Raman, S. Speck, U.K. Mishra, Experimental demonstration of III-nitride hot-electron transistor with GaN base. IEEE Electr Device Letters 32(9), 1212–1214 (2011)
G. Gupta et al., Common emitter operation of III-N HETs using AlGaN and InGaN polarization-dipole induced barriers. Device Research Conference (DRC), 2014 72nd Annual (2014), pp. 255–256
Z. Y. Digbijoy N. Nath, Pil Sung Park, and Siddharth Rajan, III-Nitride TUNNEL Injection Hot Electron Transfer Amplifier(THETA) with Common-emitter Gain. International Semiconductor Research Conference (ISDRS) (December, 2013)
Z. C. Yang, D. N. Nath, Y. Zhang, and S. Rajan, N-polar III-nitride tunneling hot electron transfer amplifier. Device Research Conference (DRC), 2014 72nd Annual (2014), pp. 173–174
M.J.W. Rodwell et al., Submicron scaling of HBTs. IEEE Trans Electr Devices 48(11), 2606–2624 (2001)
S.E. Laux, W. Lee, Collector signal delay in the presence of velocity overshoot. IEEE Electr Device Letters 11(4), 174–176 (1990)
T. Ishibashi, Influence of electron velocity overshoot on collector transit times of HBTs. IEEE Trans Electr Devices 37(9), 2103–2105 (1990)
S. Strite, H. Morkoç, GaN, AlN, and InN: A review. J. Vac. Sci. Technol. B 10(4), 1237–1266 (1992)
L. B. R. D.K. Gaskill, K. Doverspike, Electrical transport properties of A1N, GaN and AlGaN, ed. By J. Edgar. Properties of Group III Nitrides, vol. N11, EMIS Datareviews Series (1995), pp. 101–116
D. N. Nath, PhD thesis (The Ohio State University, 2013)
M. Heiblum, M.V. Fischetti, Ballistic hot-electron transistors. IBM J. Res. Dev. 34(4), 530–549 (1990)
M. Lundstrom, Fundamentals of Carrier Transport (Cambridge University Press, New York, 2000)
B.K. Ridley, M. Al-Mudares, The effect of hot phonons and coupled phonon-plasmon modes on scattering-induced NDR in quantum wells. Solid State Electron. 31(3), 683–685 (1988)
E.M. Conwell, M.O. Vassell, High-field transport in n- type GaAs. Phys. Rev. 166(3), 797–821 (1968)
W. Fawcett, A.D. Boardman, S. Swain, Monte Carlo determination of electron transport properties in gallium arsenide. J. Phys. Chem. Solids 31(9), 1963–1990 (1970)
J. Singh, Physics of Semiconductors and Their Heterostructures (McGraw-Hill series in electrical and computer engineering. Electronics and VLSI circuits) (McGraw-Hill, New York, 1993)
D.N. Nath, Z.C. Yang, C.-Y. Lee, P.S. Park, Y.-R. Wu, S. Rajan, Unipolar vertical transport in GaN/AlGaN/GaN heterostructures. Appl. Phys. Lett. 103(2), 022102–022104 (2013)
M. Heiblum, M.I. Nathan, D.C. Thomas, C.M. Knoedler, Direct observation of ballistic transport in GaAs. Phys. Rev. Lett. 55(20), 2200–2203 (1985)
A.F.J. Levi, T.H. Chiu, Room-temperature operation of hot-electron transistors. Appl. Phys. Lett. 51(13), 984–986 (1987)
J.R. Hayes, A.F.J. Levi, W. Wiegmann, Hot-Electron Spectroscopy of GaAs. Phys. Rev. Lett. 54(14), 1570–1572 (1985)
R.F. Kazarinov, S. Luryi, Charge injection over triangular barriers in unipolar semiconductor structures. Appl. Phys. Lett. 38(10), 810–812 (1981)
B.B. Varga, Coupling of Plasmons to Polar Phonons in Degenerate Semiconductors. Phys. Rev. 137(6A), A1896–A1902 (1965)
A. Kastalsky, S. Luryi, Novel real-space hot-electron transfer devices. IEEE Electr Device Letters 4(9), 334–336 (1983)
Z. Pei, A. Verma, J. Verma, X. Huili, P. Fay, and D. Jena, GaN heterostructure barrier diodes (HBD) with polarization-induced delta-doping. Device Research Conference (DRC), 2013 71st Annual (2013), pp. 203–204
Z. Yang, Y. Zhang, D.N. Nath, J.B. Khurgin, S. Rajan, Current gain in sub-10 nm base GaN tunneling hot electron transistors with AlN emitter barrier. Appl. Phys. Lett. 106(3), 032101 (2015)
M. S. William Snodgrass, and M. Feng, 150 nm InP HBT Process with Two-Level Airbridge Interconnects and MIM Capacitors for Sub-Millimeter Wave Research. presented at the CS MANTECH Conference (Tampa, Florida, USA, May 18th-21st, 2009)
J.W. LAI, W. HAFEZ, M. FENG, Vertical scaling of type I InP HBT with FT > 500 GHZ. 14(03), 625–631 (2004)
M.L. Mark Rodwell, B. Brar, InP Bipolar ICs: Scaling Roadmaps, Frequency Limits, Manufacturable Technologies. IEEE Proc 96(2), 271–286 (2008)
M. Urteaga, M. Seo, J. Hacker, Z. Griffith, A. Young, R. Pierson, P. Rowell, A. Skalare, V. Jain, E. Lobisser, M.J.W. Rodwell, InP HBTs for THz Frequency Integrated Circuits, presented at the 23rd International Conference on Indium Phosphide and Related Materials (2011)
M. Urteaga et al., A 130 nm InP HBT Integrated Circuit Technology for THz Electronics, 2016 IEEE International Electron Devices Meeting (IEDM) (2016), pp. 29.2.1–29.2.4
M. Urteaga, Z. Griffith, M. Seo, J. Hacker, M.J.W. Rodwell, InP HBT technologies for THz integrated circuits. Proc. IEEE 105(6), 1051–1067 (2017)
Author information
Authors and Affiliations
Corresponding author
Editor information
Editors and Affiliations
Rights and permissions
Copyright information
© 2020 Springer Nature Switzerland AG
About this chapter
Cite this chapter
Yang, Z., Nath, D.N., Zhang, Y., Krishnamoorthy, S., Khurgin, J., Rajan, S. (2020). III-Nitride Tunneling Hot Electron Transfer Amplifier (THETA). In: Fay, P., Jena, D., Maki, P. (eds) High-Frequency GaN Electronic Devices. Springer, Cham. https://doi.org/10.1007/978-3-030-20208-8_5
Download citation
DOI: https://doi.org/10.1007/978-3-030-20208-8_5
Published:
Publisher Name: Springer, Cham
Print ISBN: 978-3-030-20207-1
Online ISBN: 978-3-030-20208-8
eBook Packages: EngineeringEngineering (R0)