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Engineering Interfaces at the Nanoscale

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Women in Nanotechnology

Part of the book series: Women in Engineering and Science ((WES))

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Abstract

 From heat dissipation in electronic devices to the heating of our homes, thermal transport is ubiquitous in today’s technology. In the past few decades, a drive to miniaturize devices, in some cases to length scales smaller than the intrinsic mean free paths of the energy carriers, while concurrently increasing efficiency, has pushed thermal management to a primary consideration in the design and implementation of technological devices. Solid-solid interfaces serve as primary scattering sites for thermal carriers and can contribute significantly to the overall thermal resistance of the device. Controlling the interfacial resistance remains a top priority for thermal engineers, but this requires an understanding of the fundamental physics behind thermal carriers and mechanisms which can influence interfacial transport.

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Authors and Affiliations

  1. Department of Mechanical and Aerospace Engineering, University of Virginia, Charlottesville, VA, USA

    Pamela M. Norris & LeighAnn S. Larkin

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  1. Pamela M. Norris
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  2. LeighAnn S. Larkin
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Correspondence to Pamela M. Norris .

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Editors and Affiliations

  1. Department of Mechanical and Aerospace Engineering, University of Virginia, Charlottesville, VA, USA

    Pamela M. Norris

  2. Department of Materials Science and Engineering, University of Virginia, Charlottesville, VA, USA

    Lisa E. Friedersdorf

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Norris, P.M., Larkin, L.S. (2020). Engineering Interfaces at the Nanoscale. In: Norris, P., Friedersdorf, L. (eds) Women in Nanotechnology. Women in Engineering and Science. Springer, Cham. https://doi.org/10.1007/978-3-030-19951-7_8

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