Abstract
A complex investigation of structural and electrical properties in addition to the peculiarities of the ageing process in thick films based on nanostructured Cu0.1Ni0.8Co0.2Mn1.9O4 and Cu0.8Ni0.1Co0.2Mn1.9O4 ceramics were performed. Basic bulk ceramics and thick films were characterized by X-ray diffraction and scanning electron microscopy analysis. Thick films based on Cu0.1Ni0.8Co0.2Mn1.9O4 ceramics showed a higher density and microstructure homogeneity over those based on Cu0.8Ni0.1Co0.2Mn1.9O4 ceramics. The main electrical parameters of planar thick films were determined. Depending on the chemical composition of ceramics, the prepared thick films showed the resistivities within the range of 2÷40 Ω·m, being approximately 1–2 orders of magnitude larger than those of disc thermistor elements. The values of constant B25/85 ranged from 2980 to 3690 K. The thermal “shock” effect in the initial stage of isothermal exposure at 170 °C with future stabilization of electrical resistance at this level up to the final degradation test was revealed. It is shown that sensitivity to high temperature and the stabilization of electrical parameters in the thick films studied can be used for preparation of sensor components based on thick films for micro- and nanoelectronics.
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Acknowledgments
H. Klym and Yu. Kostiv thank the Ministry of Education and Science of Ukraine for support. H. Klym thanks Prof. O. Shpotyuk for discussion.
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Klym, H., Kostiv, Y., Hadzaman, I. (2019). Preparation and Complex Study of Thick Films Based on Nanostructured Cu0.1Ni0.8Co0.2Mn1.9O4 and Cu0.8Ni0.1Co0.2Mn1.9O4 Ceramics. In: Fesenko, O., Yatsenko, L. (eds) Nanocomposites, Nanostructures, and Their Applications. NANO 2018. Springer Proceedings in Physics, vol 221. Springer, Cham. https://doi.org/10.1007/978-3-030-17759-1_13
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