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State-of-the-Art Approach: System-on-Package

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Systems-Level Packaging for Millimeter-Wave Transceivers

Part of the book series: Smart Sensors, Measurement and Instrumentation ((SSMI,volume 34))

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Abstract

Up to this point in the book, two system packaging strategies have been discussed in much detail: SoC, where all system components have to appear on one IC die, and MCM, where all system components appear on two or more dice, but the packaging is shared by all of them. What both of these packaging strategies lack is provision for additional system components to be included in the package, external to all dice. This where the concept of SoP comes into play.

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Author information

Authors and Affiliations

  1. University of Johannesburg, Johannesburg, Gauteng, South Africa

    Mladen Božanić

  2. Faculty of Engineering and the Built Environment, University of Johannesburg, Johannesburg, Gauteng, South Africa

    Saurabh Sinha

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  1. Mladen Božanić
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  2. Saurabh Sinha
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Correspondence to Mladen Božanić .

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Božanić, M., Sinha, S. (2019). State-of-the-Art Approach: System-on-Package. In: Systems-Level Packaging for Millimeter-Wave Transceivers. Smart Sensors, Measurement and Instrumentation, vol 34. Springer, Cham. https://doi.org/10.1007/978-3-030-14690-0_8

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  • DOI: https://doi.org/10.1007/978-3-030-14690-0_8

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  • Publisher Name: Springer, Cham

  • Print ISBN: 978-3-030-14689-4

  • Online ISBN: 978-3-030-14690-0

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