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Novel Measurements and Analysis for Thermoelectric Devices

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Novel Thermoelectric Materials and Device Design Concepts

Abstract

Thermoelectric power generation is the premiere solid-state energy conversion technology for two very interesting niche applications: (1) low-temperature, ΔT < ~ 700 K, conversion of heat energy into electrical energy and (2) extremely small geometrical form factor cooling and refrigeration. However, evaluation, interpretation, and analysis of thermoelectric (TE) devices are not straightforward. In this work, we introduce two new methods of analyses that provide new simple experimental methods to obtain validation of TE device performance. For cooling devices, we introduce a new test where small ΔT divergence from room temperature (ΔT< 20 K) is determined in the range where ΔT changes linearly with respect to current. The test compares ΔT and the transient cooling/heating with theoretical predictions based on measured properties and thus can confirm materials’ measurements with very high accuracy. The second new analysis and empirical test allow for directly determining and, hence, validating TE figure of merit ZTmax. The significance of this new method is that it provides fast experimental method to confirm the validity of basic materials’ measurements. The measured conversion efficiency is used to extract TE device ZTmax which can be compared to individual material ZTmax measurement claims. Therefore, this approach minimizes systemic error. We demonstrate the efficacy of this method by three cases of thermoelectric power generation modules (TEGs) fabricated from different materials: low-cost module produced by the former Alphabet Energy that demonstrates ZT = 0.4, commercial module from Marlow that shows ZT = 0.7, and specialty module made by NASA JPL that has ZT = 0.95.

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References

  1. P.J. Taylor, W.A. Jesser, F.D. Rosi, Z. Derzko, A model for the non-steady-state temperature behaviour of thermoelectric cooling semiconductor devices. Semicond Sci. Technol. 12, 443 (1997)

    Article  CAS  Google Scholar 

  2. H. Wang, W.D. Porter, H. Böttner, J. König, L. Chen, S. Bai, et al., Transport Properties of bulk thermoelectrics—an international round-robin study, part I: seebeck coefficient and electrical resistivity. J. Electron. Mater. 42, 654–664 (2013)

    Article  CAS  Google Scholar 

  3. E.E. Castillo, C.L. Hapenciuc, T. Borca-Tasciuc, Thermoelectric characterization by transient Harman method under nonideal contact and boundary conditions. Rev. Sci. Instrum. 81, 044902 (2010)

    Article  Google Scholar 

  4. P.J. Taylor, A. Wilson, J.R. Maddux, T. Borca-Tasciuc, S.P. Moran, E. Castillo, et al., Novel measurement methods for thermoelectric power generator materials and devices, in Thermoelectrics for Power Generation - A Look at Trends in the Technology, ed. by S. Skipidarov, M. Nikitin, (InTech, Rijeka, Croatia, 2016), pp. 389–434

    Google Scholar 

  5. A.A. Wilson, Analysis of non-contact and contact probe-to-sample thermal exchange for quantitative measurements of thin film and nanostructure thermal conductivity by the scanning hot probe method, Doctor of Philosophy Dissertation, Mechanical, Aerospace and Nuclear Engineering, Rensselaer Polytechnic Institute, Troy, NY (2017)

    Google Scholar 

  6. A.A. Wilson, T. Borca-Tasciuc, Quantifying non-contact tip-sample thermal exchange parameters for accurate scanning thermal microscopy with heated microprobes. Rev. Sci. Instrum. 88, 074903 (2017)

    Article  Google Scholar 

  7. A.A. Wilson, T. Borca-Tasciuc, M. Martín-González, O. Caballero-Calero, and M. Muñoz Rojo, Scanning hot probe technique for thermoelectric characterization of films, in Materials Research Society Fall Meeting, Boston, MA, 2013

    Google Scholar 

  8. A.A. Wilson, M. Muñoz Rojo, B. Abad, M. Martin-Gonzalez, D. Borca-Tasciuc, and T. Borca-Tasciuc, Investigating thermal exchange parameters between a heated microprobe and sample, in International Conference of Thermoelectrics/European Conference of Thermoelectrics (Dresden, 2015)

    Google Scholar 

  9. A.A. Wilson, M. Munoz Rojo, B. Abad, J.A. Perez, J. Maiz, J. Schomacker, et al., Thermal conductivity measurements of high and low thermal conductivity films using a scanning hot probe method in the 3omega mode and novel calibration strategies. Nanoscale 7, 15404–15412 (2015)

    Article  CAS  Google Scholar 

  10. P.J. Taylor, J.R. Maddux, P.N. Uppal, Measurement of thermal conductivity using steady-state isothermal conditions and validation by comparison with thermoelectric device performance. J. Electron. Mater. 41, 2307–2312 (2012)

    Article  CAS  Google Scholar 

  11. R.J. Buist, A new method for testing themoelectric materials and devices, in 11th International Conference on Thermoelectrics (Arlington, TX, 1992)

    Google Scholar 

  12. J. Juszczyk, A. Kazmierczak-Balata, P. Firek, J. Bodzenta, Measuring thermal conductivity of thin films by scanning thermal microscopy combined with thermal spreading resistance analysis. Ultramicroscopy 175, 81–86 (2017)

    Article  CAS  Google Scholar 

  13. T. Borca-Tasciuc, A.R. Kumar, G. Chen, Data reduction in 3ω method for thin-film thermal conductivity determination. Rev. Sci. Instrum. 72, 2139–2147 (2001)

    Article  CAS  Google Scholar 

  14. G. Chen, T. Borca-Tasciuc, Experimental techniques for thin-film thermal conductivity characterization, in Thermal Conductivity, ed. by T. M. Tritt, (Kluwer Academic/Plenum Publishers, New York, NY, 2004), pp. 205–2327

    Google Scholar 

  15. A.J. Schmidt, R. Cheaito, M. Chiesa, A frequency-domain thermoreflectance method for the characterization of thermal properties. Rev. Sci. Instrum. 80, 094901 (2009)

    Article  Google Scholar 

  16. Y. Zhang, C.L. Hapenciuc, E.E. Castillo, T. Borca-Tasciuc, R.J. Mehta, C. Karthik, et al., A microprobe technique for simultaneously measuring thermal conductivity and seebeck coefficient of thin films. Appl. Phys. Lett. 96, 062107 (2010)

    Article  Google Scholar 

  17. C. Dames, Measuring the thermal conductivity of thin films: 3 omega and related electrothermal methods. Ann. Rev. Heat Transfer 16, 7–49 (2013)

    Article  Google Scholar 

  18. M.L. Bauer, P.M. Norris, General bidirectional thermal characterization via the 3omega technique. Rev. Sci. Instrum. 85, 064903 (2014)

    Article  Google Scholar 

  19. D. Zhao, X. Qian, X. Gu, S.A. Jajja, R. Yang, Measurement techniques for thermal conductivity and interfacial thermal conductance of bulk and thin film materials. J. Electr. Pack. 138, 040802 (2016)

    Article  Google Scholar 

  20. H.J. Goldsmid, The Thermal Conductivity of Bismuth Telluride. Proc. Phys. Soc. B 69, 203–209 (1956)

    Article  Google Scholar 

  21. Z.H. Dughaish, Lead telluride as a thermoelectric material for thermoelectric power generation. Physica B 322, 205–223 (2002)

    Article  CAS  Google Scholar 

  22. X. Shi, H. Kong, C.P. Li, C. Uher, J. Yang, J.R. Salvador, et al., Low thermal conductivity and high thermoelectric figure of merit in n-type BaxYbyCo4Sb12 double-filled skutterudites. Appl. Phys. Lett. 92, 182101 (2008)

    Article  Google Scholar 

  23. C.M. Bhandari, D.M. Rowe, Boundary scattering of phonons. J. Phys. C Solid State Phys. 11, 1787–1794 (1978)

    Article  CAS  Google Scholar 

  24. D.M. Rowe, V.S. Shukla, The effect of phonon-grain boundary scattering on the lattice thermal conductivity and thermoelectric conversion efficiency of heavily doped fine-grained, hot-pressed silicon germanium alloy. J. Appl. Phys. 52, 7421–7426 (1981)

    Article  CAS  Google Scholar 

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Correspondence to Patrick J. Taylor .

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© 2019 This is a U.S. Government work and not under copyright protection in the U.S.; foreign copyright protection may apply

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Taylor, P.J., Wilson, A.A., Hendricks, T., Drymiotis, F., Villalpando, O., Fleurial, JP. (2019). Novel Measurements and Analysis for Thermoelectric Devices. In: Skipidarov, S., Nikitin, M. (eds) Novel Thermoelectric Materials and Device Design Concepts. Springer, Cham. https://doi.org/10.1007/978-3-030-12057-3_13

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