Abstract
Nano-bridge style Josephson junctions have the possibility of creating a dense high temperature superconducting circuits. The junctions are created using to two step etch. The first, wide area etch defines the overall shape of the Josephson junction and the second etch defines a small non-superconducting barrier by thinning the material to a thickness that cannot support the superconducting state. The wide area etching of the high temperature superconductor yttrium barium copper oxide (YBCO) is very sensitive to high temperature and water, which can destroy its superconducting properties. We have explored several different methods of wet etching of YBCO and determined their effects on the superconductivity of the material. The wet etches examined are weak acid etches of nitric acid, phosphoric acid, and a bromine alcohol solution. The bromine alcohol solution prove to be the ideal etch for our purposes.
Access this chapter
Tax calculation will be finalised at checkout
Purchases are for personal use only
References
G. Bednorz, K.A. Multer, Z. Fhvs. B 64, 189 (1086)
Y. Yoshizaki, M. Tonouchi, T. Kobayashi, Jpn. Journal Appl. Phys. 26(2), 9 (1987)
R.P. Vasquez, B.D. Hunt, M.C. Foote, Appl. Phys. Lett. 53(26), (1988)
M.K. Wu, J.R. Ashburn, C.T. Torng, P.H . Hor, R.L. Meng, L. Gao, Z.J. Huang, Y.J. Wang, C.W. Chu, Phys. Rev. Lett. 58, 908 (1987)
Acknowledgments
The author would like to thank the staff at CalIT2 Nano3 staff for help and use of their facilities.
Author information
Authors and Affiliations
Corresponding author
Editor information
Editors and Affiliations
Rights and permissions
Copyright information
© 2019 Springer Nature Switzerland AG
About this paper
Cite this paper
Emery-Adleman, T., Taylor, B. (2019). Fabrication of YBCO Josephson Junction Using Wet Etching. In: In, V., Longhini, P., Palacios, A. (eds) Proceedings of the 5th International Conference on Applications in Nonlinear Dynamics. Understanding Complex Systems. Springer, Cham. https://doi.org/10.1007/978-3-030-10892-2_23
Download citation
DOI: https://doi.org/10.1007/978-3-030-10892-2_23
Published:
Publisher Name: Springer, Cham
Print ISBN: 978-3-030-10891-5
Online ISBN: 978-3-030-10892-2
eBook Packages: EngineeringEngineering (R0)