Abstract
In many applications in electronic power, and high-voltage engineering, there is a need to improve the electrical properties of existing insulation systems and/or to develop novel insulation materials with properties more suitable with the changing requirements, particularly in the electrotechnical area. During the last few decades, a considerable attention has been given to the possible use of polymeric nanocomposites systems, usually a nonconductive polymer containing nanometric inorganic fillers, as a replacement to the neat polymers offering better electrical and thermal properties. There is almost, nowadays, a consensus among the scientific community that such property enhancements can only be achieved when the nano-fillers present a reasonably good size dispersion and spatial distribution within the host polymer. However, due to nano-fillers’ strong tendency to agglomerate and their generally poor compatibility with commonly used polymers, to reach optimal dispersions has been found challenging in most cases. In order to improve the polymer/particles’ compatibility and therefore to avoid agglomeration and poor-dispersion problems, polyhedral oligomeric silsesquioxanes (POSS) appear to be a filler of choice since they are by nature nanoscaled molecules bearing built-in functionalities which can be selected according to the chemical nature of the host polymer. This chapter summarizes the investigations that were reported so far on the electrical properties of epoxy/POSS, PE/POSS, and PP/POSS systems. The general conclusion is that in the case of polyolefin/POSS composites, nanoscale dispersion was found to be hard to reach despite the selection alkyl-type POSS and the dielectric properties were not found to be strongly improved while in the case of epoxy/POSS systems, the selection of appropriate POSS compounds and a carefully chosen resin/additive/hardener ratio allow nanoscale dispersion accompanied with noticeable improvements of the dielectric properties.
This is a preview of subscription content, log in via an institution.
Buying options
Tax calculation will be finalised at checkout
Purchases are for personal use only
Learn about institutional subscriptionsReferences
Kremer F, Schönhals A,(eds) (2003) Broadband dielectric spectroscopy. Springer-Verlag, Berlin
Jonscher AK (1983) Dielectric relaxation in solids. Chelsea Dielectrics Press, London
Runt, JP Fitzgerald JJ (eds) (1997) Dielectric Spectroscopy of Polymeric Materials: Fundamentals and Applications. ACS, Washington D.C
IEEE Standard 930 (2005) IEEE guide for the statistical analysis of electrical insulation breakdown data. IEEE Dielectrics and Electrical Insulation Society
Daran-Daneau C, David E, Fréchette MF, Savoie S (2012) Influence of the surrounding medium on the dielectric strength measurement of LLDPE/clay nanocomposites. In: IEEE international symposium on electrical insulation, pp 654–658
Helal E, David E, Fréchette M, Demarquette NR (2017) Thermoplastic elastomer nanocomposites with controlled nanoparticles dispersion for HV insulation systems: correlation between rheological, thermal, electrical and dielectric properties. Eur Polymer J 94:68–86
Fina A, Tabuani D, Frache A, Camino G (2005) Polypropylene–polyhedral oligomeric silsesquioxanes (POSS) nanocomposites. Polymer 46:7855–7866
Takala M, Karttunen M, Salovaara P, Kortet S, Kannus K, Kalliohaka T (2008) Dielectric properties of nanostructured polypropylene-polyhedral oligomeric silsesquioxane compounds. IEEE Trans Dielectr Electr Insul 15:40–51
Huang X, Xie L, Jiang P, Wang G, Yin Y (2009) Morphology studies and ac electrical property of low density polyethylene/octavinyl polyhedral oligomeric silsesquioxane composite dielectrics. Eur Polymer J 45:2172–2183
Horwath, J, Schweickart D (2009) Inorganic fillers for corona endurance enhancement of selected polymers. In: IEEE international power modulator and high voltage conference (IPMHVC), pp 644–647
Guo M (2017) Polyethylene/polyhedral oligomeric silsesquioxanes composites: electrical insulation for high-voltage power cables, Ph.D. thesis, École de Technologie Supérieure
Guo M, David E, Fréchette M, Demarquette NR (2017) Polyethylene/polyhedral oligomeric silsesquioxanes composites: dielectric, thermal and rheological properties. Polymer 115:60–69
Guo M, Fréchette M, David E, Demarquette NR (2015) Polyethylene-based dielectric composites containing polyhedral oligomeric silsesquioxanes obtained by ball milling. Trans Electr Electron Mater 16:53–61
Guo M, Fréchette M, David E, Demarquette NR, Daigle JC (2017) Polyethylene/polyhedral oligomeric silsesquioxanes composites: electrical insulation for high voltage power cables. IEEE Trans Dielectr Electr Insul 24:798–807
Fréchette M, Guo M, David E, Min D, Li S (2017) The dielectric response of polyethylene/polyhedral oligomeric silsesquioxanes composites at various temperatures. IEEE conference on electrical insulation and dielectric phenomenon, pp 501–504
Guo M, David E, Fréchette M, Demarquette NR (2016) Low-Density Polyethylene/Polyhedral Oligomeric Silsesquioxanes Composites Obtained by Extrusion. In: IEEE conference on electrical insulation and dielectric phenomena, pp 647–650
Guo M, Fréchette M, David E, Demarquette NR (2016) Influence of fabrication techniques on the dielectric properties of PE/POSS polymeric composites. In: IEEE electrical insulation conference, pp 297–300
Guo M, Fréchette M, David E, Demarquette NR Daigle JC (2014) Polyethylene-based nanodielectrics containing octaisobutyl polyhedral oligomeric silsesquioxanes obtained by solution blending in xylene. In: IEEE conference on electrical insulation and dielectric phenomena, pp 731–734
DeArmitt C (2013) Polyhedral oligomeric silsesquioxane handbook http://phantomplastics.com/wp-content/uploads/2013/08/POSS-Handbook.pdf
Suryanarayana C (2001) Mechanical alloying and milling. Prog Mater Sci 46:1–184
Jonscher AK (1996) Universal relaxation law. Chelsea Dielectrics Press, London
Roy M, Nelson JK, MacCrone RK, Schadler LS, Reed CW, Keefe R, Zenger W (2005) Polymer nanocomposite dielectrics—the role of the interface. In: IEEE Trans. on dielectrics and electrical insulation, vol 12. pp 629–643
Tsekmes IA, Morshuis PHF, Smit JJ, Kochetov R (2015) Enhancing the thermal and electrical performance of epoxy microcomposites with the addition of nanofillers. IEEE Electr Insul Mag 31(3):32–42
Helal E, Pottier C, David E, Fréchette M, Demarquette NR (2018) Polyethylene/thermoplastic elastomer/Zinc Oxide nanocomposites for high voltage insulation applications: dielectric, mechanical and rheological behavior. Eur Polymer J 100:258–269
Nicholson JW (2012) The chemistry of polymers, Royal Society of Chemistry, London
Lee H, Neville K (1967) Handbook of Epoxy Resins, McGraw Hill, New York
Tesoro G (1988) In: May CA(ed) Epoxy resins-chemistry and technology, 2nd edn. Marcel Dekker, New York
Mustata F, Bicu I, Cascaval CN (1997) Rheological and thermal behaviour of an epoxy resin modified with reactive diluents. J Polym Eng 17:491–506
Wang RM, Zheng SR, Zheng YP (2011) Polymer matrix composites and technology, Woodhead Publishing, Cambridge
Liao YH, Marietta-Tondin O, Liang ZY, Zhang C, Wang B (2004) Investigation of the dispersion process of SWNTs/SC-15 epoxy resin nanocomposites. Mater Sci Eng A 385:175–181
Hong SG, Wu CS (1998) DSC and FTIR analysis of the curing behaviors of epoxy/DICY/solvent open systems. Thermochim Acta 316:167–175
Loos MR, Coelho LAF, Pezzin SH, Amico SC (2008) The effect of acetone addition on the properties of epoxy. Polimeros-Ciencia E Tecnologia 18:76–80
Bakar M, Duk R, Przybylek M, Kostrzewa M (2009) Mechanical and thermal properties of epoxy resin modified with polyurethane. J Reinf Plast Compos 28:2107–2118
Harani H, Fellahi S, Bakar M (1999) Toughening of epoxy resin using hydroxyl-terminated polyesters. J Appl Polym Sci 71:29–38
Suprapakorn N, Dhamrongvaraporn S, Ishida H (1998) Effect of CaCO3 on the mechanical and rheological properties of a ring-opening phenolic resin: polybenzoxazine. Polym Compos 19:126–132
Tang B, Liu XB, Zhao XL, Zhang JH (2014) Highly efficient in situ toughening of epoxy thermosets with reactive hyperbranched polyurethane, J Appl Polym Sci, 131
Heid T, Fréchette M, David E (2016) Enhanced electrical and thermal performances of nanostructured epoxy/POSS composites. IEEE Trans Dielectr Electr Insul 23:1732–1742
Saeedi IA, Vaughan AS, Andritsch T (2016) On the dielectric performance of modified epoxy networks. In: IEEE international conference on dielectrics
Saeedi IA, Andritsch T, Vaughan AS (2017) Modification of resin/hardener stoichiometry using POSS and its effect on the dielectric properties of epoxy resin systems. In: International symposium on electrical insulating materials (ISEIM), pp 366–369
Horwath J, Schweickart D, Garcia G, Klosterman D, Galaska M (2005) Improved performance of polyhedral oligomeric silsesquioxane epoxies. In: IEEE conference on electrical insulation and dielectric phenomena, pp 155–157
Horwath JC, Schweickart DL, Garcia G, Klosterman D, Galaska M, Schrand A, Walko LC (2006) Improved electrical properties of epoxy resin with nanometer-sized inorganic fillers. In: Conference record of the 2006 twenty-seventh international power modulator symposium, pp 189–191
Heid T, Fréchette M, David E (2014) Nanostructured epoxy/POSS composites: high performance dielectrics with improved breakdown strength and corona resistance. In: IEEE conference on electrical insulation and dielectric phenomena, pp 659–662
Huang X, Li Y, Liu F, Jiang P, Iizuka T, Tatsumi K, Tanaka T (2014) Electrical properties of epoxy/POSS composites with homogeneous nanostructure. IEEE Trans Dielectr Electr Insul 21:1516–1528
Heid T, Fréchette M, David E (2015) Nanostructured epoxy/POSS composites: enhanced materials for high voltage insulation applications. IEEE Trans Dielectr Electr Insul 22:1594–1604
Bocek J, Matejka L, Mentlik V, Trnka P, Slouf M (2011) Electrical and thermomechanical properties of epoxy-POSS nanocomposites. Eur Polym J 47:861–872
Lin Z, Lau S, Moon KS, Wong CP (2012) Polyhedral oligomeric silsesquioxanes (POSS)-filled underfill with excellent high temperature performance. In: IEEE electronic components and technology conference, pp 1599–1604
Mya KY, He CB, Huang JC, Xiao Y, Dai J, Siow YP (2004) Preparation and thermornechanical properties of epoxy resins modified by octafunctional cubic silsesquioxane epoxides. J Polym Sci Part a-Polym Chem 42:3490–3503
Takala M, Karttunen M, Pelto J, Salovaara P, Munter T, Honkanen M, Auletta T, Kannus K (2008) Thermal, mechanical and dielectric properties of nanostructured epoxy-polyhedral oligomeric silsesquioxane composites. IEEE Trans Dielectr Electr Insul 15:1224–1235
Heid T, Fréchette M, David E (2014) Nanostructured epoxy/POSS composites: high performance dielectrics with improved corona resistance and thermal conductivity. In: IEEE electrical insulation conference, pp 316–319
Zhang ZP, Liang GZ, Wang XL (2007) The effect of POSS on the thermal properties of epoxy. Polym Bull 58:1013–1020
Villanueva M, Martin-Iglesias JL, Rodriguez-Anon JA, Proupin-Castineiras J (2009) Thermal study of an epoxy system DGEBA (n = 0)/MXDA modified with POSS. J Therm Anal Calorim 96:575–582
Kourkoutsaki Th, Logakis E, Kroutilova I, Matejka L, Nedbal J, Pissis P (2009) Polymer dynamics in rubbery epoxy networks/polyhedral oligomeric silsesquioxanes nanocomposites. J Appl Polym Sci 113:2569–2582
Nelson JK (ed) (2010) Dielectric polymer nanocomposites. Springer Science + Business Media, New York, NY
David E, Fréchette M (2013) Polymer nanocomposites—major conclusions and achievements reached so Far. IEEE Electr Insul Mag 29(6):29–36
Author information
Authors and Affiliations
Corresponding author
Editor information
Editors and Affiliations
Rights and permissions
Copyright information
© 2018 Springer Nature Switzerland AG
About this chapter
Cite this chapter
David, E., Andritsch, T. (2018). Dielectric Properties of Epoxy/POSS and PE/POSS Systems. In: Kalia, S., Pielichowski, K. (eds) Polymer/POSS Nanocomposites and Hybrid Materials. Springer Series on Polymer and Composite Materials. Springer, Cham. https://doi.org/10.1007/978-3-030-02327-0_7
Download citation
DOI: https://doi.org/10.1007/978-3-030-02327-0_7
Published:
Publisher Name: Springer, Cham
Print ISBN: 978-3-030-02326-3
Online ISBN: 978-3-030-02327-0
eBook Packages: Chemistry and Materials ScienceChemistry and Material Science (R0)