Abstract
This chapter considers composites for thermal applications, including the basic principles related to the thermal behavior of materials. The applications include thermal conduction, heat dissipation, thermal insulation, heat retention, heat storage, rewritable optical discs, and shape-memory actuation.
This is a preview of subscription content, log in via an institution to check access.
Access this chapter
Tax calculation will be finalised at checkout
Purchases are for personal use only
Bibliography
References
C.-K. Leong, Y. Aoyagi and D.D.L. Chung, “Carbon-Black Thixotropic Thermal Pastes for Improving Thermal Contacts”, J. Electron. Mater. 34(10), 1336–1341 (2005).
C.-K. Leong, Y. Aoyagi and D.D.L. Chung, “Carbon Black Pastesas Coatings for Improving Thermal Gap-Filling Materials”, Carbon 44(3), 435–440 (2006).
C.-K. Leong and D.D.L. Chung, “Carbon Black Dispersions as Thermal Pastes That Surpass Solder in Providing High Thermal Contact Conductance”, Carbon 41(13), 2459–2469 (2003).
D.D.L. Chung, “Advances in Thermal Interface Materials”, Adv. Microelectron. 33(4), 8–11 (2006).
Y. Xu, C.-K. Leong and D.D.L. Chung, “Carbon Nanotube Dispersions as Thermal Pastes”, J. Electron. Mater. 36(9), 1181–1187 (2007).
H. Huang, C. Liu, Y. Wu and S. Fan, “Aligned Carbon Nanotube Composite Films for Thermal Management”, Adv. Mater. 17, 1652–56 (2005).
T.A. Howe, C.-K. Leong and D.D.L. Chung, “Comparative Evaluation of Thermal Interface Materials for Improving the Thermal Contact Between an Operating Computer Microprocessor and its Heat Sink. J. Electron. Mater. 35(8):1628–1635 (2006).
C. Lin and D.D.L. Chung, ”Graphite Nanopletelet Pastes versus Carbon Black Pastes as Thermal Interface Materials“, Carbon 47(1), 295–305 (2009).
C. Lin and D.D.L. Chung, ”Effect of Carbon Black Structure on the Effectiveness of Carbon Black Thermal Interface Pastes“, Carbon 45(15), 2922–31 (2007).
X. Fu and D.D.L. Chung, ”Effect of Admixtures on the Thermal and Thermomechanical Behavior of Cement Paste,“ ACI Mater. J. 96(4), 455–461 (1999).
Further Reading
P.P.S.S. Abadi, C.-K. Leong and D.D.L. Chung, ”Factors that Govern the Performance of Thermal Interface Materials“, J. Electron. Mater. 38(1), 175–192 (2009).
Y. Aoyagi and D.D.L. Chung, ”Antioxidant-based phase-change thermal interface materials with high thermal stability“, J. Electron. Mater. 37(4), 448–461 (2008).
Y. Aoyagi, C.-K. Leong and D.D.L. Chung, ”Polyol-Based Phase-Change Thermal Interface Materials“, J. Electron. Mater. 35(3), 416–424 (2006).
D.D.L. Chung, ”Materials for Thermal Conduction“, Appl. Therm. Eng. 21 (ER16), 1593–1605 (2001).
D.D.L. Chung, ”Cement-Matrix Composites for Thermal Engineering“, Appl. Therm. Eng. 21(ER16), 1607–1619 (2001).
D.D.L. Chung, ”Advances in Thermal Interface Materials“, Adv. Microelectron. 33(4), 8–11 (2006).
D.D.L. Chung and C. Zweben, ”Composites for Electronic Packaging and Thermal Management“, Comprehensive Composite Materials, Pergamon, Oxford, 2000, vol. 6, pp. 701–725.
Z. Liu and D.D.L. Chung, ”Calorimetric Evaluation of Phase Change Materials for Use as Thermal Interface Materials“, Thermochim. Acta 366(2), 135–147 (2001).
Z. Liu and D.D.L. Chung, ”Boron Nitride Particle Filled Paraffin Wax as a Phase-Change Thermal Interface Material”, J. Electron. Packag. 128(4), 319–323 (2006).
Z. Mei and D.D.L. Chung, “Thermoplastic Matrix Phase Transitions in a Carbon Fiber Composite, Studied by Contact Electrical Resistivity Measurement of the Interface between Two Unbonded Laminae”, Polym. Compos. 23(5), 824–827 (2002).
Rights and permissions
Copyright information
© 2010 Springer-Verlag London Limited
About this chapter
Cite this chapter
(2010). Thermal Properties. In: Composite Materials. Engineering Materials and Processes. Springer, London. https://doi.org/10.1007/978-1-84882-831-5_8
Download citation
DOI: https://doi.org/10.1007/978-1-84882-831-5_8
Publisher Name: Springer, London
Print ISBN: 978-1-84882-830-8
Online ISBN: 978-1-84882-831-5
eBook Packages: Chemistry and Materials ScienceChemistry and Material Science (R0)