Study on Effect of Material Strain Rate in Contact Layer on Surface Integrity in Quick-point Grinding

Abstract

Quick-point grinding is a new grinding process with the high or super-high grinding wheel speed, the less contact length between the wheel and the workpiece and the super-high strain rate in the contact layer. Based on the studies on the materials strain rate characters and the impact performances in the contact layer, the weakening effects of the super-high strain rate on the removing materials mechanism and the micro-plastic pile-up deformation on the ground surface, and the model of the ground surface roughness of point grinding process in this paper, it is realized that quick-point grinding is the typical super impulsive process like blast and impact during the removing material process. The weakening effects of the super-high strain rate caused by the mechanical impact micro-damages and the adiabatic shearing damage can lower the dynamic strength of the contact layer, therefore, it is possible to improve the surface integrity of the workpiece since the materials removal mechanism is changed in the grinding process. In addition, the point grinding experiments were performed for the surface roughness of workpiece to testify the such studies in this paper.