Abstract
This monograph reviews bilayer and alloy techniques with Ti, Al and others to form adhesion layers and diffusion barriers. The temperature range of thermal stability is covered. During Ti and Al transport to form the encapsulating layers, the Ag films develop <111> texture. Integration with low-K dielectrics such as paralene has been demonstrated. Encapsulated Ag films have superior resistance to electromigration degradation.
This is a preview of subscription content, log in via an institution to check access.
Access this chapter
Tax calculation will be finalised at checkout
Purchases are for personal use only
Preview
Unable to display preview. Download preview PDF.
References
S. P. Murarka, R. J. Guttman, A. E. Kaloyeros, W. A. Lanford, Thin Solid Films 236, 257(1993).
M. E. C. Willemsen, A. E. T. Kuiper, A. H. Reader, R. Hokke, J. C. Barbour, J. Vac. Sci. Technol. B 6, 53(1988).
S. Q. Wang, I. Raaijmakers, B. J. Burrow, S. Suthar, K. B. Kim, J. Appl. Phys. 68, 176(1990).
T. L. Alford, D. Adams, T. Laursen, B. M. Ullrich, Appl. Phys. Lett. 68, 3251(1996).
Y. L. Zou, T. L. Alford, D. Adams, T. Laursen, K. N. Tu, R. Morton, S. S. Lau, MRS Proc. 427, 355(1996).
J. Li, J. W. Mayer, E. G. Colgan, J. Appl. Phys. 70, 2820(1991).
D. Adams, T. L. Alford, N. D. Theodore, S. W. Russell, R. L. Spreitzer, J. W. Mayer, Thin Solid Films 262, 199(1995).
Y. Wang, T. L. Alford, Appl. Phys. Lett. 74(1), 32(1999).
D. Adams, Ph.D. dissertation, Arizona State University, 1996.
M. Mahadevan, R. M. Bradley, J. M. Bebierre, Europhys. Lett. 45, 80(1999).
P. S. Ho, H. B. Huntington, J. Phys. Chem. Solids 307, 1319(1966).
H. R. Patil, H. B. Huntington, J. Phys. Chem. Solids 31, 463(1970).
S. M. Klotsman, A. N. Timofeyev, I. S. Trakhtenberg, Phys. Metal Metallogr. 14, 140(1962).
H.M. Breitling, R. E. Hummel, J. Phys. Chem. Solids 33, 845(1972).
R. E. Hummel, H. J. Geier, Thin Solid Films 25, 335(1975).
Y. Zeng, L. H. Chen, Y. L. Zou, P. A. Nguyen, J. D. Hensen, T. L. Alford, Mater. Lett. 45, 157(2000).
D. Adams, T. L. Alford, Materials Science and Engineering R 40, 207(2003).
Rights and permissions
Copyright information
© 2008 Springer-Verlag London Limited
About this chapter
Cite this chapter
(2008). Summary. In: Silver Metallization. Engineering Materials and Processes. Springer, London. https://doi.org/10.1007/978-1-84800-027-8_7
Download citation
DOI: https://doi.org/10.1007/978-1-84800-027-8_7
Publisher Name: Springer, London
Print ISBN: 978-1-84800-026-1
Online ISBN: 978-1-84800-027-8
eBook Packages: Chemistry and Materials ScienceChemistry and Material Science (R0)