Abstract
Active disassembly technology provides the designer a useful unmanned disassembly processes to achieve efficient recycling for products. Currently, many types of smart active fasteners are developed by using shape memory plastics (SMP). This technology has been testing in cell phones and LCD TVs to confirm the concepts. This paper presents an eco-innovative design methodology by using TRIZ method to innovate the new concepts of smart active fasteners for active disassembly at the end-of-life stage of products. The tools of TRIZ, such as contradiction matrix, inventive principles, and substance-field analysis, are chosen in this study to develop this eco-innovative design methodology. Examples are demonstrated to illustrate the capability of proposed methodology.
This is a preview of subscription content, log in via an institution.
Buying options
Tax calculation will be finalised at checkout
Purchases are for personal use only
Learn about institutional subscriptionsPreview
Unable to display preview. Download preview PDF.
8 References
Jones, E., Harrison, D., 2000, Investigating the Use of TRIZ in Eco-Innovation, The TRIZ Journal, September, 2000.
Low, M.K., Lamvik, T., Walsh, K., Myklebust, O., 2000, Product to Service Eco-Innovation: The TRIZ Model of Creativity Explored, Proceedings of 2000 International Symposium on Electronics and Environment, San Francisco, California, May 8–10, 209–214.
Chen, J.L., Liu, C.C., 2002, Green Innovation Design of Products by TRIZ Inventive Principles and Green Evolution Rules, 2002 International CIRP Design Seminar, Hong Kong, May 16–18.
Chang, H.T., Chen, J.L., 2003, An Eco-Innovative Design Method Based on Design Around Approach, Third International Symposium on Environmentally Conscious Design and Inverse Manufacturing, Ecodesign03, Tokyo, Japan, December 8–11.
Kobayashi, H., 2003, Idea Generation and Risk Evaluation Methods for Life Cycle Planning, Third International Symposium on Environmentally Conscious Design and Inverse Manufacturing, Ecodesign03, Tokyo, Japan, December 8–11.
Mann, D., 2003, Systematic Sustainable Innovation, in Sustainable Innovation 03: Creating Sustainable Products, Services and Product-service-System, Towards Sustainable Product Design (Ed. M. Charter), 8th International Conference. Stockholm, Sweden, October 27–28.
Chen, J.L., Liu, C.C., 2001, An Eco-Innovative Design Approach Incorporating the TRIZ Method without Contradiction Analysis, Journal of Sustainable Product Design, 1/4, 263–272.
Liu, C.C., Chen, J.L., 2001, Development of Product Green Innovation Design Method, Second International Symposium on Environmentally Conscious Design and Inverse Manufacturing, Ecodesign01, Tokyo, Japan, December 12–15, 168–173.
Liu, C.C., Chen, J.L., 2001, A TRIZ Inventive Product Design Method without Contradiction Information, The TRIZ Journal, September 2001.
Chen, J.L., 2002, Green Evolution Rules and Ideality Laws for Green Innovative Design of Products, Proceedings of Going Green-Care Innovation 2002, 4th International Symposium, Vienna, November 25–28.
Chang, H.T., Chen, J.L., 2004, The Conflict-Problem-Solving CAD Software Integrating TRIZ into Eco-Innovation, Journal of Advances in Engineering Software, 35, 553–566.
Chang, H.T., Chen, J.L., 2003, Eco-Innovative Examples for 40 TRIZ Inventive Principles, The TRIZ Journal, August 2003.
Chen, J.L., Liu, C.C., 2003, An Eco-Innovative Design Method by Green QFD and TRIZ Tools, International Conference on Engineering Design, ICED03, Stockholm, Sweden, August 19–21.
Strasser, C., Wimmer, W., 2003, Eco-Innovation, Combining Ecodesign and TRIZ for Environmentally Sound Product Design, International Conference on Engineering Design, ICED03, Stockholm, Sweden, August 19–21.
Strasser, C., Wimmer, W., 2003, Supporting Customer Driven Eco-Solutions — Implementing Ecodesign in the Daily Work of Product Developers, Third International Symposium on Environmentally Conscious Design and Inverse Manufacturing, Ecodesign03, Tokyo, Japan, December 8–11.
Yen, S.B., Chen, J.L., 2004, Integrating FMEA with TRIZ for Eco-Innovation, Proceedings of Electronics Going Green2004+, Care Innovation 2004: Driving Forces for Future Electronics, 5th International Symposium, Berlin, September, 509–513.
Yen, S.B., Chen, J.L., 2005, An Eco-Innovative Tool by Integrating FMEA with TRIZ Methods, Fourth International Symposium on Environmentally Conscious Design and Inverse Manufacturing, Ecodesign05, Tokyo, Japan, December 11–14.
Chang, H.T., 2005, The Study of Integrating Su-Field Analysis Modeling with Eco-Innovative Concept for Product Design, Fourth International Symposium on Environmentally Conscious Design and Inverse Manufacturing, Ecodesign05, Tokyo, Japan, December 11–14.
Chang, H.T., Ko, Y.C., 2006, An Eco-Innovative Problem-Solving Design Process Combing TRIZ Su-Field Model and Standards, Proceedings of Going Green-Care Innovation 2006, 6th International Symposium, Vienna, November 13–16.
Chen, J.L., Andrew, H.L., 2006, A Life Cycle Concept Based Eco-Innovative Method by TRIZ Tools, Proceedings of Going Green-Care Innovation 2006, 6th International Symposium, Vienna, November 13–16.
Mann, D., Dewulf, S., Zlotin, B., Zusman, A., 2003, Matrix 2003: Updating the Contradiction Matrix, CREAX Press, February, Belgium.
Justel, D., Vidal, R., Chinner, M., 2005, TRIZ Applied for Eco-Innovation in Design for Disassembly, 1st IFIP Working conference on Computer Aided Innovation, November 14–15, Ulm, Germany.
Justel, D., Vidal, R., Chinner, M., 2006, TRIZ Applied to Innovate in Design for Disassembly, 13th CIRP International Conference on Life Cycle Engineering, May31–June 2, 377–382.
Chiodo, J.D., Jones, N., Billett, E.H., Harrison, D. J., 2002, Shape Memory Alloy Actuators for Active Disassembly Using Smart Materials of Consumer Electronic Products, Materials and Design, 23, 471–478.
Koyu, S. Hideo, O., Masanobu, T., Takeo, Y., 2005, Study of Auto-Disassembly System Using Shape Memory Materials, Third International Symposium on Environmentally Conscious Design and Inverse Manufacturing, Ecodesign03, Tokyo, Japan, December 8–11.
Chiodo, J.D., Billett, E.H., Harrison, D.J., 1999, Preliminary Investigations of Active Disassembly Using Shape Memory Polymers, First International Symposium on Environmentally Conscious Design and Inverse Manufacturing, Ecodesign99, Tokyo, Japan, February 1–4.
Chiodo, J.D., McLaren, J., Billett, E.H., Harrison, D.J., 2000, Isolating LCD’s at End-of-life Using Active Disassembly Technology: A Feasibility Study, Proceedings of 2000 International Symposium on Electronics and Environment, San Francisco, California, May 8–10, 318–323.
Chiodo, J.D., Billett, E.H., Harrison, D.J., 1999, Active Disassembly Using Shape Memory Polymers for the Mobile Phone Industry, Proceedings of 1999 International Symposium on Electronics and Environment, Danvers, Massachusetts, May 11–13, 151–156.
Duflou, J.R., Willems, B., Dewulf, W., 2005, Towards Self-Disassembling Products: Design Solutions for Economically Feasible Large-Scale Dosassembly, Proceedings of the 12th CIRP Seminar on Life Cycle Engineering, Laboratoire Sols Solids Structures — Grenoble — France.
Willems, B., Dewulf, W., Duflou, J.R., 2006, Concepts and Verification Model for Pressure Triggered One-to-many Disassembly Fasteners, 13th CIRP International Conference on Life Cycle Engineering, May31–June 2, 405–410.
Klett, J, Blessing L., 2006, Systematic Design of Connections, 13th CIRP International Conference on Life Cycle Engineering, May31–June 2, 417–422.
Savransky, S.D., 2000, Engineering of Creativity, CRC Press, Boca Raton, FL.
Terninko, J., Zusman, A., Zlotin, B., 1998, Systematic Innovation: An Introduction to TRIZ, St. Lucie Press, Boca Raton, FL.
Author information
Authors and Affiliations
Editor information
Editors and Affiliations
Rights and permissions
Copyright information
© 2007 Springer-Verlag London Limited
About this paper
Cite this paper
Chen, J.L., Chen, WC. (2007). TRIZ Based Eco-Innovation in Design for Active Disassembly. In: Takata, S., Umeda, Y. (eds) Advances in Life Cycle Engineering for Sustainable Manufacturing Businesses. Springer, London. https://doi.org/10.1007/978-1-84628-935-4_15
Download citation
DOI: https://doi.org/10.1007/978-1-84628-935-4_15
Publisher Name: Springer, London
Print ISBN: 978-1-84628-934-7
Online ISBN: 978-1-84628-935-4
eBook Packages: EngineeringEngineering (R0)