Abstract
Software Thermal Management is a systems level concern that considers schematic capture, Printed Circuit Board (PCB) layout, mechanical design, materials science, software engineering, and use-case scenarios. The landscape is large and approaches are not standardized. This chapter reviews the history of Moore’s Law, the limitations of parallelism, and the special role that software engineers have to play when managing thermals in an embedded system.
The more I learn, the more I realize I don’t know. The more I realize I don’t know, the more I want to learn.
Albert Einstein.
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Notes
- 1.
A via (Latin for path or way) is an electrical connection between layers in a physical electronic circuit (e.g. a PCB) that goes through the plane of one or more adjacent layers.
- 2.
For a given processor, \(C\) is fixed. However, \(V\) and \(f\) vary. Caveats: (1) Some CPU instructions use less energy per tick of the CPU clock than others; (2) Static power consumption of the CPU (power consumed when the CPU is not doing meaningful work) is not represented by this equation. Static power consumption does vary with temperature, however. Warm electrons, especially those exposed to a stronger electromagnetic field are more likely to migrate across gates, and are considered “gate leakage” current, adding to the total static power consumption of the CPU.
- 3.
The field of Software Thermal Management is similar to the concept of software power management, except that it is narrower in scope, and focuses on thermal performance of the system instead of broadly looking at system-wide power draw.
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Benson, M. (2014). Landscape: History, Present Barriers, and The Road Forward. In: The Art of Software Thermal Management for Embedded Systems. Springer, New York, NY. https://doi.org/10.1007/978-1-4939-0298-9_2
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