Abstract
Originally, epoxy resins were used as adhesives because they had unique adhesive-cohesive characteristics. Today they are widely used as potting materials for electronic components and assemblies because they possess excellent electrical and physical properties. However, their tendency to crack under severe conditions of temperature and vibration is a serious drawback to encapsulating and potting operations because a loss of effective moisture and chemical seal over the components may result and, except where repair is unobjectionable, cracked units must usually be scrapped.
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References
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© 1962 Springer Science+Business Media New York
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Davis, B.A. (1962). Potting Problems Related to Packaging Design. In: Walker, G.A. (eds) Advances in Electronic Circuit Packaging. Springer, Boston, MA. https://doi.org/10.1007/978-1-4899-7311-5_6
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DOI: https://doi.org/10.1007/978-1-4899-7311-5_6
Publisher Name: Springer, Boston, MA
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