Abstract
Due to the new demands imposed upon industry to manufacture electronic equipments requiring but a small fraction of the space their forerunners once occupied, major problems have arisen in packaging and interconnecting. For manufacturing reasons, the industry found it to be most practical to construct the equipments in modular form. For maintenance reasons, it was desirable that the modules be plug-ins. This is exemplified by the plug-in card systems in general use today. Another factor is that of heat dissipation, which further complicates the over-all problem.
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References
R. C. Swengel and W. R. Evans, “A New Mechanical Approachfor the Construction of Modular Electronic Equipments.” ASME, Aviation Conference, Los Angeles, Calif. (March, 1961), No. 61—AV-3.
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© 1962 Springer Science+Business Media New York
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Wasiele, H. (1962). Maintainable Electronic Component Assemblies. In: Walker, G.A. (eds) Advances in Electronic Circuit Packaging. Springer, Boston, MA. https://doi.org/10.1007/978-1-4899-7311-5_10
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DOI: https://doi.org/10.1007/978-1-4899-7311-5_10
Publisher Name: Springer, Boston, MA
Print ISBN: 978-1-4899-7297-2
Online ISBN: 978-1-4899-7311-5
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