Abstract
This paper will describe a packaging concept aimed at achieving component densities higher than with normal “laydown” techniques; providing for ease of engineering-change activity; automated assembly; and utilizing both welded and soldered connections. There was no direct attempt at miniaturization.
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© 1963 Springer Science+Business Media New York
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Ciccone, R.D., Lorenz, E.J. (1963). A Unique Approach to Welded Packaging. In: Rosine, L.L. (eds) Advances in Electronic Circuit Packaging. Springer, Boston, MA. https://doi.org/10.1007/978-1-4899-7309-2_9
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DOI: https://doi.org/10.1007/978-1-4899-7309-2_9
Publisher Name: Springer, Boston, MA
Print ISBN: 978-1-4899-7296-5
Online ISBN: 978-1-4899-7309-2
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