Abstract
This paper describes the use of chemical milling and adhesive bonding for construction of strong, lightweight, reliable chassis for airborne electronics equipment. Also included is an addendum describing results of vibration tests carried out for airborne equipment.
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© 1963 Springer Science+Business Media New York
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Karpuk, J.P., Erickson, E.A. (1963). The Design of a Chemically Milled and Adhesive-Bonded Airborne Indicator Unit. In: Rosine, L.L. (eds) Advances in Electronic Circuit Packaging. Springer, Boston, MA. https://doi.org/10.1007/978-1-4899-7309-2_25
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DOI: https://doi.org/10.1007/978-1-4899-7309-2_25
Publisher Name: Springer, Boston, MA
Print ISBN: 978-1-4899-7296-5
Online ISBN: 978-1-4899-7309-2
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