Abstract
This paper presents a discussion of microelectric connections and microminiature electronic design. Included are a section on circuit design philosophy, descriptions of conductive adhesives currently in use, and a discussion of the gold foil and gallium alloy connection techniques.
This is a preview of subscription content, log in via an institution to check access.
Access this chapter
Tax calculation will be finalised at checkout
Purchases are for personal use only
Preview
Unable to display preview. Download preview PDF.
Bibliography
Conductive Adhesives
Printed Circuit Techniques,“ Circular 468, National Bureau of Standards, Washington, D.C.
J. M. C. Dukes, Printed Circuits MacDonald Publishing Company, London, England.
Proceedings of the Symposium on Printed Circuits, 1955, Radio-ElectronicsTelevision Manufacturers Association.
Frank Z. Keister, “Evaluation of Conductive Adhesives for Microelectronic Applications,” Electro-Technology, January, 1962.
Timothy J. Kildruff and A. A. Benderly, “Conductive Adhesive for Electronic Applications,” Electrical Manufacturing, June, 1958.
H. E. Pebley, Director, Plastics Technical Evaluation Center, Picatinny Arsenal, Dover, New Jersey, Private Communication, March 19, 1962.
R. F. Klinger, Aeronautical Systems Division, Wright-Patterson Air Force Base, Ohio, Private Communication, February 15, 1962.
L. D. Jaffe and J. B. Ritenhouse, “Behavior of Materials in Space Environments,” Technical Report No. 32–150, Jet Propulsion Laboratory, Pasadena, California.
Gallium Alloys
Detailed Techniques for Preparing and Using Hard Gallium Alloys,“ Technical Note 140, National Bureau of Standards, Washington, D. C.
Gallium Alloys for Low-Temperature Bonding,“ Technical News Bulletin 45, No. 1, National Bureau of Standards, January 1961.
George C. Harman, “Some Comments on the Use and Preparation of Hard Gallium Alloys,” Review of Scientific Instruments 32, No. 4, April 1961.
Gallium Alloys for Low-Temperature Bonding in Electronic Devices,“ Electro-Technology May 1961.
D. L. Smith and H. J. Caul, “Alloys of Gallium with Powdered Metals as Possible Replacement for Dental Amalgam,” Journal of American Dental Association 53, September 1956.
D. L. Smith and H. J. Caul, “Some Physical Properties of GalliumCopper-Tin Alloys,” Journal of American Dental Association 53, December 1956.
Richard N. Lyon, Liquid Metals Handbook Atomic Energy Commission (NAVEXOS P-733 Rev.).
Author information
Authors and Affiliations
Editor information
Rights and permissions
Copyright information
© 1963 Springer Science+Business Media New York
About this chapter
Cite this chapter
Goodykoontz, J.R., Brewen, F.T., Brock, B.D., Heindl, J.C. (1963). Microelectronic Connections. In: Rosine, L.L. (eds) Advances in Electronic Circuit Packaging. Springer, Boston, MA. https://doi.org/10.1007/978-1-4899-7309-2_19
Download citation
DOI: https://doi.org/10.1007/978-1-4899-7309-2_19
Publisher Name: Springer, Boston, MA
Print ISBN: 978-1-4899-7296-5
Online ISBN: 978-1-4899-7309-2
eBook Packages: Springer Book Archive