Abstract
This study was undertaken to evaluate present methods for sealing electronic packages intended for space environment for 1 year or more. Temperatures of −34° to 150°C and a typical package, 12 by 8 by 6 in., were used. Containers should be fabricated from wrought metals drawn to shape or machined from a solid wrought block. If joints are welded, the materials should be carefully selected to minimize porosity and the development of residual stresses. Welds should be stress-relieved after welding. Covers are best sealed by soft-soldering. Welding is next recommended. The elastomer Gasko-Seal is best for package maintainability but least reliable when compared with soldering or welding because of the difficulty in obtaining reliable leak data. Sealed connectors can be obtained with permissible leakage rates but should be leak-tested before package installation.
This study was supported by Air Force Space Systems Division, Air Force Systems Command, under contract AF 04(647)-532.
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© 1963 Springer Science+Business Media New York
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Shafran, A. (1963). Space Seal Study. In: Rosine, L.L. (eds) Advances in Electronic Circuit Packaging. Springer, Boston, MA. https://doi.org/10.1007/978-1-4899-7309-2_12
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DOI: https://doi.org/10.1007/978-1-4899-7309-2_12
Publisher Name: Springer, Boston, MA
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