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Radiation Effects in Epoxies Used as Encapsulants for Electronic Packages

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Abstract

Scotchcast-type epoxies are among those encapsulants which are being considered for applications in outer space. It is expected that these epoxies will be exposed to a considerable dosage of radiation when flown in space. At LMSC we radiated Scotchcast-type epoxies in a cobalt source and tested the influence of this radiation to the epoxy. A special microtransducer was embedded into the material as a sensor, which allowed monitoring the behavior of the sample under test. It is shown that radiation leads to an after-curing effect, which decays exponentially with time. After a dosage of approximately 106 roentgens, the material is completely cured. Besides these curing effects, a shift of the secondary transition point from +10 to +25°C was experienced. This shift of the secondary transition point from a low temperature into the room-temperature range can lead to difficulties for the circuit designer. The results of the test indicate that electronic components embedded into Scotchcast-type materials are not too greatly affected by changes in the epoxy due to radiation.

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References

  1. J. Dallimore, F. F. Stucki, and D. Kasper, “Measurements of Internal Stress in Electronic Encapsulat-ing Resins with a Small Solid-State Transducer,” Reg. Conference of the Society of Plastic Engr., Syracuse, New York, April 1963.

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  2. R. W. Roos, C. F. Kooi, and M. E. Baldwin, “Neutron, and Gamma Irradiation of Some Square-Loop and Microwave Ferrites,” Transactions of AIEE Communication and Electronics, Paper 60–1015, September 1961, pp. 1–5.

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  3. J. P. Nichols and E. D. Arnold, “Shielding Isotopic Power Sources for Space Missions,” Nucleonics, February 1964, pp. 52–56.

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Lawrence L. Rosine (Editor, EDN)

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© 1965 Springer Science+Business Media New York

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Stucki, F.F. (1965). Radiation Effects in Epoxies Used as Encapsulants for Electronic Packages. In: Rosine, L.L. (eds) Advances in Electronic Circuit Packaging. Springer, Boston, MA. https://doi.org/10.1007/978-1-4899-7307-8_25

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  • DOI: https://doi.org/10.1007/978-1-4899-7307-8_25

  • Publisher Name: Springer, Boston, MA

  • Print ISBN: 978-1-4899-7295-8

  • Online ISBN: 978-1-4899-7307-8

  • eBook Packages: Springer Book Archive

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