Abstract
A method of packaging integrated circuits on plug-in modules suitable for commercial, industrial, or military applications is described in this paper. Some of the problems that are common to any method of designing plug-in modules for packaging integrated circuits are discussed, and the specific solutions that were developed are described in detail. A cost breakdown of the complete assembled module is given, and the methods for adapting the design for thin-film circuits are also described.
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References
A. H. Faulkner, F. Gurzi, and E. L. Hughes, “Magic—An Advanced Computer for Spaceborne Guidance Systems,” Proceedings of the Spaceborne Computer Engineering Conference, Anaheim, October 30, 1962, pp. 83–94.
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W. H. Ayer and T. E. Kirchner, “Integrated Circuit Packaging and Interconnections,” 1963 Western Electronics Show and Conference, San Francisco, August 1963.
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© 1965 Springer Science+Business Media New York
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Painter, A.V., Allen, R.A. (1965). Semiconductor Circuits and Modular Packaging. In: Rosine, L.L. (eds) Advances in Electronic Circuit Packaging. Springer, Boston, MA. https://doi.org/10.1007/978-1-4899-7307-8_23
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DOI: https://doi.org/10.1007/978-1-4899-7307-8_23
Publisher Name: Springer, Boston, MA
Print ISBN: 978-1-4899-7295-8
Online ISBN: 978-1-4899-7307-8
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