Abstract
Recent developments in heat-shrinkable radiation-cross-linked plastics have made possible a number of new devices for encapsulating components and terminating wires. Over the past several years irradiated heat-shrinkable tubings and molded products have been used in increasing quantities for harness coverings, for the strain relief of wire terminations and connectors, wire markers, and component covers. The new cross-linked heat-shrinkable plastics may be used in combination with (1) other thermoplastics and sealants for the encapsulation of components and (2) solders for wire terminations. This paper describes the recent developments in cross-linked materials and the application of these new developments in encapsulating and terminating devices.
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© 1965 Springer Science+Business Media New York
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Sherlock, P. (1965). Use of Radiation-Cross-Linked Materials for Encapsulating and Terminating Devices. In: Rosine, L.L. (eds) Advances in Electronic Circuit Packaging. Springer, Boston, MA. https://doi.org/10.1007/978-1-4899-7307-8_2
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DOI: https://doi.org/10.1007/978-1-4899-7307-8_2
Publisher Name: Springer, Boston, MA
Print ISBN: 978-1-4899-7295-8
Online ISBN: 978-1-4899-7307-8
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