Interconnection and Organization of Functional Electronic Blocks

Abstract

Norden has developed a packaging concept specifically designed to organize and interconnect logical groupings of microelectronic integrated circuits, both thin-film and semiconductor circuits, and hybrid combinations of both. The basic submodule building block approach consists of stacking functional electronic blocks (FEBs) and casting them rigidly within an insulative three-dimensional supporting structure. The FEB leads are flush and exposed on the surface planes of the submodule thus formed. The exposed FEB terminations are interconnected on a batch process basis simultaneously rather than sequentially by vapor-phase nickel deposition. Subtractive photo-etching techniques define the conductive interconnect pattern. The submodule permits handling and assembly into the next level of system organization by conventional well-known methods. Wire bound split-pin connections were evaluated as an optional method of interconnecting submodules. The technique provided a practical demonstration for making this type of permanent connection, a connection that could be severed and remade a finite number of times, on 0.050-in. centers. The program has demonstrated the feasibility of utilizing this submodule building block approach for efficient packaging densities, preservation of device reliability and economy in manufacture, and produces an optimum solution to the problem of interconnection and organization of functional electronic blocks.