Abstract
Most electronic assemblies are fabricated by connecting discrete packaged components in the desired circuit and then packaging by potting in plastic. Transfer-molding techniques, along with semiconductor surface passivation techniques, have been developed that eliminate the redundancy of this repackaging of hermetically sealed semiconductor packages. This approach has been used to produce a family of miniature diode assemblies. Easier assembly and smaller size, as well as lower costs, have been achieved.
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References
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© 1965 Springer Science+Business Media New York
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Bell, H.B., Doyle, G.A. (1965). Packaging of Miniature Diode Assemblies. In: Rosine, L.L. (eds) Advances in Electronic Circuit Packaging. Springer, Boston, MA. https://doi.org/10.1007/978-1-4899-7307-8_10
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DOI: https://doi.org/10.1007/978-1-4899-7307-8_10
Publisher Name: Springer, Boston, MA
Print ISBN: 978-1-4899-7295-8
Online ISBN: 978-1-4899-7307-8
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