Integrated Circuit Fabrication Processes

  • M. J. Morant
Part of the Tutorial Guides in Electronic Engineering book series (TGEE, volume 18)

Abstract

Studying this chapter should enable you
  • □ To understand which aspects of integrated circuit fabrication have an impact on design.

  • □ To understand the basic processes of doping, oxide masking, photolithography, and metallization used in all silicon device fabrication, and the additions required for many IC fabrication processes.

  • □ To learn how the individual fabrication stages are used to build up a complete CMOS circuit.

  • □ To appreciate the requirements for photolithographic masks for ICs.

  • □ To learn about yield, the cost of producing chips, and the effects of chip area on the cost.

Keywords

Chip Area Doping Profile Contact Window Entire Wafer Contact Hole 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

Preview

Unable to display preview. Download preview PDF.

Unable to display preview. Download preview PDF.

Copyright information

© Martin J. Morant 1990

Authors and Affiliations

  • M. J. Morant
    • 1
  1. 1.School of Engineering and Applied ScienceUniversity of DurhamUSA

Personalised recommendations