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Potentiometric Determination of Copper in Various Plating Baths

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Abstract

Copper impurities at the concentration level 10-4 M in plating baths can cause deterioration of the physical properties of coatings.1,2 Several analytical methods of determination of copper in presence of very large excess of other heavy metals are available but they are usually time consuming and susceptible to errors due to necessity of preliminary copper separation.

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References

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Hulanicki, A., Sokalski, T., Lewenstam, A. (1990). Potentiometric Determination of Copper in Various Plating Baths. In: Ivaska, A., Lewenstam, A., Sara, R. (eds) Contemporary Electroanalytical Chemistry. Springer, Boston, MA. https://doi.org/10.1007/978-1-4899-3704-9_14

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  • DOI: https://doi.org/10.1007/978-1-4899-3704-9_14

  • Publisher Name: Springer, Boston, MA

  • Print ISBN: 978-1-4899-3706-3

  • Online ISBN: 978-1-4899-3704-9

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