Abstract
Competitive trends to miniaturize Micro Electro Mechanical Systems (MEMS) introduce unprecedented requirements on their designs. To satisfy these challenges new materials and structural designs are being employed. Complex structures of modern micromechanical assemblies and electronic packages must withstand wide ranges of applied or generated mechanical, thermal or electrical loads. To ensure their optimum design, functionality and reliability, hybrid experimental/numerical methods of analysis called ACES (Analytical, Computational and Experimental Solution) are being implemented.1 These include:
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forming theoretical models of structure behaviour and implementing them into FEM (Finite Elements Method) analysis; and,
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incorporating knowledge about the accurate geometry of the object being modeled, including local small scale irregularities, which due to unique processing procedures, high stress levels and small feature sizes may differ from bulk material properties.2
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© 1997 Springer Science+Business Media New York
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Patorski, K., Kujawinska, M. (1997). Micromechanics: New Challenges for Optical Measurements. In: Martellucci, S., Chester, A.N. (eds) Diffractive Optics and Optical Microsystems. Springer, Boston, MA. https://doi.org/10.1007/978-1-4899-1474-3_28
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DOI: https://doi.org/10.1007/978-1-4899-1474-3_28
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