Deposition of Adherent, Thick Copper Coatings on Glass

  • W. C. Cowden
  • T. G. Beat
  • T. A. Wash
  • J. W. Dini

Abstract

Glass parts were successfully coated with copper as thick as 1 mm using the combined technologies of vacuum deposition and electroplating. The key elements to the process were: preparation of the glass substrates, deposition of a low stress titanium binder layer by physical vapor deposition followed by a 6 μm thick layer of copper without breaking vacuum, and then electroplating 1 mm of copper in acid sulfate solution. An extremely important part of this work was the deposition of copper with as close to zero stress as possible. Data were generated on the influence of plating current density on stress and mechanical properties.

Keywords

Physical Vapor Deposition Copper Plating Binder Layer Mechanical Property Data Single Point Diamond 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

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References

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Copyright information

© Springer Science+Business Media New York 1989

Authors and Affiliations

  • W. C. Cowden
    • 1
  • T. G. Beat
    • 1
  • T. A. Wash
    • 1
  • J. W. Dini
    • 1
  1. 1.Lawrence Livermore National LaboratoryLivermoreUSA

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