Deposition of Adherent, Thick Copper Coatings on Glass
Glass parts were successfully coated with copper as thick as 1 mm using the combined technologies of vacuum deposition and electroplating. The key elements to the process were: preparation of the glass substrates, deposition of a low stress titanium binder layer by physical vapor deposition followed by a 6 μm thick layer of copper without breaking vacuum, and then electroplating 1 mm of copper in acid sulfate solution. An extremely important part of this work was the deposition of copper with as close to zero stress as possible. Data were generated on the influence of plating current density on stress and mechanical properties.
KeywordsPhysical Vapor Deposition Copper Plating Binder Layer Mechanical Property Data Single Point Diamond
Unable to display preview. Download preview PDF.
- 1.J. W. Dini, Plating Surface Finish, 72, 48 (July 1985)Google Scholar
- 2.J. W. Dini, Synergism of electroplating and vacuum processes, Proceedings First International SAMPE Metals Conference (August 1987)Google Scholar
- 4.V. A. Lamb and D. R. Valentine, Plating, 52, 1289 (1965)Google Scholar
- 5.V. A. Lamb and D. R. Valentine, Plating, 53, 86 (1966)Google Scholar