Advertisement

Simple Metal-on-Plastics Patterning by Pulsed Electron Beam in Soft Vacuum

  • J. Krishnaswamy
  • M. Eyolfson
  • L. Li
  • G. J. Collins
  • H. Hiraoka
  • M. A. Caolo

Abstract

Direct patterning of polyimide images with a built-on-metal layer can be accomplished by electron beam exposures of doped polyamic acid films, followed by wet development in NMP and subsequent heating and curing to polyimide films. During curing at 300°C the metal salts converted to metal and migrated to the top surface of polyimide films. Additional electron beam exposures of images assisted metal film formation. Auger electron and Rutherfold backscattering spectroscopic analyses were carried out to confirm metal migration to the surface. Silver nitrate, gold mercaptide and cupric chloride were used as dopants in polyamic acid films.

Keywords

Silver Nitrate Rutherford Backscatter Spectroscopy Direct Patterning Polyimide Film Pulse Electron Beam 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

Preview

Unable to display preview. Download preview PDF.

Unable to display preview. Download preview PDF.

References

  1. 1.
    L.T. Taylor, and A.K. St.Clair, J. Appl. Polym. Sci., 28, 2393 (1983).CrossRefGoogle Scholar
  2. 2.
    L.T. Taylor, and A.K. St.Clair, U.S. Patent 284,461 (1981).Google Scholar
  3. 3.
    S.A. Ezzell, T.A. Furtsch, E. Khor, and L.T. Taylor, J. Polym. Sci. Polym. Chem. Ed., 21, 865 (1983).CrossRefGoogle Scholar
  4. 4.
    A. Auerbach, J. Electrochem. Soc., 131, 937 (1984).CrossRefGoogle Scholar
  5. 5.
    T.L. Wohlford, J.S. Schaaf, L.T. Taylor, T.A. Furtsch, E. Khor, and A.K. St.Clair, in “Conductive Polymers” R.B. Seymour, Editor, Plenum Press, New York, p.7, 1981.CrossRefGoogle Scholar
  6. 6.
    J. Krishnaswamy. L. Li, G. J. Collins, H. Hiraoka, and M. A. Caolo, paper presented at the Fall Meeting, Materials Research Soc, Boston, 1987.Google Scholar
  7. 7.
    J. Krishnaswamy, L. Li, G. J. Collins, H. Hiraoka, and M.A. Caolo, SPIE Vol. 773, “Electron-Beam, X-ray and Ion-Beam Lithographies VI,” p.159 (1987).Google Scholar
  8. 8.
    J.M. Burkstrand, J. Vac. Sci. Technol., 16, 363 (1979).CrossRefGoogle Scholar
  9. 9.
    Y.-H. Kim, G.F. Walker, J. Kim, and J. Park, J. Adhesion Sci. Technol., 1, 339 (1987).CrossRefGoogle Scholar
  10. 10.
    Y.-H. Kim, J. Kim, G.F. Walker, C. Feger, and S.P. Kowalczyk, J. Adhesion Sci. Technol., 2, 95 (1988).CrossRefGoogle Scholar

Copyright information

© Springer Science+Business Media New York 1989

Authors and Affiliations

  • J. Krishnaswamy
    • 1
  • M. Eyolfson
    • 1
  • L. Li
    • 1
  • G. J. Collins
    • 1
  • H. Hiraoka
    • 2
  • M. A. Caolo
    • 3
  1. 1.Department of Electrical EngineeringColorado State UniversityFort CollinsUSA
  2. 2.IBM Almaden Research CenterSan JoseUSA
  3. 3.Hewlett-Packard Inc.Fort CollinsUSA

Personalised recommendations