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Graded Metallization of Nonconducting Substrates by Glow Discharge Plasma Polymerization

  • Byung K. Sun
  • Dong L. Cho
  • Thomas J. O’Keefe
  • H. Yasuda

Abstract

The research described concerns the application of a composition graded film for use as a preplate for metallizing nonconducting materials. The composition of the graded film, which changes from 100% organic to nearly pure metallic over the thickness of the film, eliminates sudden changes in material structure and chemical composition between two dissimilar materials, and assists in establishing a stronger, more durable interface. The graded film was layered onto various polymeric substrates by glow discharge plasma polymerization, and the final metallizing material was plated onto the graded film electrolytically.

Keywords

Copper Particle Electroless Plating Plasma Polymer Peel Strength Oxygen Plasma Treatment 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

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Copyright information

© Springer Science+Business Media New York 1989

Authors and Affiliations

  • Byung K. Sun
    • 1
  • Dong L. Cho
    • 1
  • Thomas J. O’Keefe
    • 1
  • H. Yasuda
    • 1
  1. 1.Graduate Center for Materials ResearchUniversity of Missouri-RollaRollaUSA

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