Graded Metallization of Nonconducting Substrates by Glow Discharge Plasma Polymerization

  • Byung K. Sun
  • Dong L. Cho
  • Thomas J. O’Keefe
  • H. Yasuda


The research described concerns the application of a composition graded film for use as a preplate for metallizing nonconducting materials. The composition of the graded film, which changes from 100% organic to nearly pure metallic over the thickness of the film, eliminates sudden changes in material structure and chemical composition between two dissimilar materials, and assists in establishing a stronger, more durable interface. The graded film was layered onto various polymeric substrates by glow discharge plasma polymerization, and the final metallizing material was plated onto the graded film electrolytically.


Copper Particle Electroless Plating Plasma Polymer Peel Strength Oxygen Plasma Treatment 
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Copyright information

© Springer Science+Business Media New York 1989

Authors and Affiliations

  • Byung K. Sun
    • 1
  • Dong L. Cho
    • 1
  • Thomas J. O’Keefe
    • 1
  • H. Yasuda
    • 1
  1. 1.Graduate Center for Materials ResearchUniversity of Missouri-RollaRollaUSA

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