Graded Metallization of Nonconducting Substrates by Glow Discharge Plasma Polymerization
The research described concerns the application of a composition graded film for use as a preplate for metallizing nonconducting materials. The composition of the graded film, which changes from 100% organic to nearly pure metallic over the thickness of the film, eliminates sudden changes in material structure and chemical composition between two dissimilar materials, and assists in establishing a stronger, more durable interface. The graded film was layered onto various polymeric substrates by glow discharge plasma polymerization, and the final metallizing material was plated onto the graded film electrolytically.
KeywordsCopper Particle Electroless Plating Plasma Polymer Peel Strength Oxygen Plasma Treatment
Unable to display preview. Download preview PDF.
- 1.Robert W. Berry, Peter M. Hall, and Murray T. Harris, “Thin Film Technology”, Chap. 3, D. Van Nostrand Company, Princeton, New Jersey, 1968.Google Scholar
- 4.James H. Lindsay and Joseph Lasala, Plating and Surface Finishing, 54 (July, 1985).Google Scholar
- 7.P. J. Dynes and D. H. Kaelble, J. Macromol. Sci.-Chem, A10(3). 535–557 (1976).Google Scholar
- 8.D. L. Cho, Y.-S. Yeh, and H. Yasuda, J. Vac. Sci. Technol., submitted.Google Scholar
- 10.D. L. Cho, Ph.D. Dissertation, University of Missouri-Rolla, 1986.Google Scholar