Adhesion and Deformation Behavior of Thin Metal Films on Polyimide

  • Y. H. Jeng
  • F. Faupel
  • S. T. Chen
  • P. S. Ho

Abstract

Adhesion and interfacial failure of Cr,Cu and Cu/Cr films on the PMDA-ODA polyimide substrates have been investigated using a stretch deformation technique. This method determines the adhesion energy by measuring the difference in the load vs. elongation curves between film/substrate and substrate structures. The effects due to the addition of a Cr interface layer between polyimide and Cu on the build-up of stress and the onset of failure have been investigated. This study shows that by varying the thickness of Cr interface one can alter the extent of ductile to brittle transition of the deformation behavior of the metal/polyimide layered structure.

Keywords

Deformation Behavior Crack Formation Adhesion Energy Peel Test Thin Metal Film 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

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Copyright information

© Springer Science+Business Media New York 1989

Authors and Affiliations

  • Y. H. Jeng
    • 1
  • F. Faupel
    • 1
  • S. T. Chen
    • 1
  • P. S. Ho
    • 1
  1. 1.IBM Thomas J. Watson Research CenterYorktown HeightsUSA

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