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Metal Interlayers in Polymer Films: A Survey of Deposition Processes, Morphology, Patterning Methods and Physical Properties

  • S. Mazur
  • L. E. Manring
  • M. Levy
  • G. T. Dee
  • S. Reich
  • C. E. Jackson

Abstract

Metal interlayer deposition comprises a new family of wet-chemical processes by which a dense, electrically continuous metal film can be grown within the bulk of a pre-existing polymer film. The present article reviews three generic forms of the process, namely: electroless, polymer-mediated electrochemical, and carrier-mediated electrochemical deposition. Experimental examples are given with particular emphasis on polyimides as the matrix material. Mechanistic principles which govern the kinetics and morphology of the deposition are described.

Keywords

Polymer Film Cathode Surface Polyimide Film Pyromellitic Dianhydride Polyamic Acid 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

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Copyright information

© Springer Science+Business Media New York 1989

Authors and Affiliations

  • S. Mazur
    • 1
  • L. E. Manring
    • 1
  • M. Levy
    • 1
  • G. T. Dee
    • 1
  • S. Reich
    • 1
  • C. E. Jackson
    • 1
  1. 1.Central Research and Development DepartmentE. I. du Pont de Nemours & Co., Inc.WilmingtonUSA

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