Plasma Induced Deposition of Copper Films on Polymer Surfaces

  • R. Padiyath
  • M. David
  • S. V. Babu

Abstract

Thin copper films have been deposited on Kapton® and silicon substrates by reducing films of copper formate in a hydrogen RF discharge. Auger electron spectroscopy (AES) analysis and X-ray diffractometry (XRD) have been used to characterize the films. The oxygen content of the as-deposited copper films has been reduced to about 1% by annealing in a hydrogen ambient at about 300°C. However, only the upper 20–25 nm thick surface layers of the films were found to be rich (>90%) in copper. The remainder of the film was contaminated with carbon and traces of iron. Process conditions that may minimize the carbon content in the bulk of the film are discussed. A new laser ablation technique appears to be more promising.

Keywords

Hydrogen Plasma Copper Film Copper Chloride Copper Formate Laser Ablation Technique 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

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Copyright information

© Springer Science+Business Media New York 1991

Authors and Affiliations

  • R. Padiyath
    • 1
  • M. David
    • 1
  • S. V. Babu
    • 1
  1. 1.Department of Chemical EngineeringClarkson UniversityPotsdamUSA

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